Amazon Technologies, Inc.

Ross Kenneth Thayer

David Eric Peters

John Avery Howard

Jason Conrad Chamberlain

Described are techniques for controlling the transfer of heat on various portions of a device or other structure. A structure may include a substrate having a first thermal conductivity. A material having a different thermal conductivity is distributed on the substrate. The position, quantity, and thickness of the material affects the manner in which heat is transferred away from at least one hot spot on the substrate.

Structure for transferring heat in devices

An electronic device housing is described that includes a substantially flat support plate comprising a composite material and an edge frame comprising a foam material. The edge frame is coupled to the support plate at a perimeter of the support plate and defines a cavity. One or more electronic components may be disposed in the cavity.

Electronic device housing

Described are features to control distribution of thermal energy by structures such as portions of a case of a device. Various patterns of thermally conductive or insulating substances alter the thermal conductivity of a structure and provide selective directional distribution of thermal energy away from a hot spot caused by operation of a device component. The features result in a predetermined distribution of thermal energy across one or more structures, and may increase thermal uniformity.

Altering thermal conductivity in devices

Solid structures for thermal management are provided. In one aspect, the solid structures can comprise a metal-ceramic composite member assembled to be in thermal contact with a heat source. The metal-ceramic composite member can be mechanically coupled to an assembly (e.g., an electronic assembly) containing the heat source, and can provide mechanical stability to such assembly. In another aspect, the solid structures can comprise an oxide member that covers a surface of the metal-ceramic composite member, forming a metal-ceramic-oxide interface at the surface. The thickness of the oxide member combined with the magnitude of its thermal conductivity relative to the thermal conductivity of the metal-ceramic composite member can permit heat transport substantially along a direction substantially parallel to the metal-ceramic-oxide interface, and can reduce heat transfer through such interface.

Solid structures for thermal management

An electronic device housing including a relatively thin and stiff support plate and including a relatively thick and low-density edge frame is described. The support plate may be composed of a composite material, such as carbon-fiber reinforced polymer or aluminum metal matrix composite, and the edge frame may be composed of a foam material, such as closed-cell aluminum foam.

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Santa Clara, CA, United States of America

Ross Kenneth Thayer