Rockwell Collins, Inc.

Hamilton Sundstrand Corporation

Ross Keith Wilcoxon

Nathan P Lower

Alan P Boone

James R Wooldridge

David W Cripe

David W Dlouhy

James B West

Ram Ranjan

Jeremiah Damien Wolf

John C Mather

Reginald D Bean

William E Rhoden

Kimberly Rae Saviers

Nathaniel P Wyckoff

Anders P Walker

Russell C Tawney

Brandon C Hamilton

Kathryn L Kirsch

Bret W Simon

David D Hillman

David M Brower

James D Sampica

Paul R Nemeth

Tracy J Barnidge

Bryan S McCoy

Joseph L Tchon

William C Jennings

Jeffrey Ewanchuk

Peter M Sahayda

Wajih A El Sallal

Sandra S Dudley

John K Hagge

Qizhou Matthew Yao

David L Westergren

Anthony J Strzelczyk

John A Chihak

Brian K Otis

Pete Sahayda

Haley Steffen

Luke R Porisch

Haley M Steffen

A heat sink with a primary flow volume, an inlet, an outlet, a bottom plate, a top plate, distribution, heat transfer and collector sections, and flow paths between pillars. The inlet cross-section defines the primary flow volume cross-section and the length of the primary flow volume extends into the heat sink at a right angle to the inlet cross-section. The distribution section is proximate to the flow inlet and has distribution pillars extending from the bottom or top plate. The heat transfer section is proximate to the distribution section and has heat transfer pillars extending from the bottom or top plate. The collector section is proximate to the heat transfer section and has collector pillars extending from the bottom or top plate. The distribution cross-section is greater than the heat transfer cross-section which is smaller than the collector cross-section. The outlet and the flow paths extend outside of the primary flow volume.

Varying topology heat sinks

A system for cooling a power component includes a first metal layer. A cooling layer having a first surface is in contact with a surface of the first metal layer. A second metal layer is included having a surface in contact with a second surface of the cooling layer opposite the first metal layer. The cooling layer is of a material different from that of the first metal layer and that of the second metal layer. A plurality of cooling features are embedded in the material of the cooling layer. The cooling channels are spaced apart from both the first metal layer and the second metal layer by the material of the cooling layer. An electrically conductive path connects the first metal plate to the second metal plate.

Cooling in conductors for chips

A heat sink with a primary flow volume, an inlet, an outlet, a bottom plate, a top plate, distribution, heat transfer and collector sections, and flow paths between pillars. The inlet cross-section defines the primary flow volume cross-section and the length of the primary flow volume extends into the heat sink at a right angle to the inlet cross-section. The distribution section is proximate to the flow inlet and has distribution pillars extending from the bottom or top plate. The heat transfer section is proximate to the distribution section and has heat transfer pillars extending from the bottom or top plate. The collector section is proximate to the heat transfer section and has collector pillars extending from the bottom or top plate. The distribution cross-section is greater than the heat transfer cross-section which is smaller than the collector cross-section. The flow paths extend outside of the primary flow volume.

Phased array antennas, such as a multi-function aperture, are limited in performance and reliability by traditional air-cooled thermal management systems. A fuel-cooled multi-function aperture passes engine fuel through channels within the ribs of the multi-function aperture to provide better heat transfer than can be achieved through air cooled systems. The increased heat transfer and thermal management results in a multi-function aperture with improved performance and reliability.

Heat exchanger rib for multi-function aperture

A structural connector system for providing an electrical connection between electronic componentry is disclosed. The structural connector system includes a structural member, including an electrically insulating matrix, an electrically conducting path, a first end surface, a second end surface, and a first component engaging surface. The first component engaging surface includes a first mechanical coupler configured to mechanically couple a first electronic component or a first chassis component to the structural member and a first electrical coupler configured to electrically couple the first electronic component or the first chassis component to a first end of the electrically conducting path. The structural member further includes a second component engaging surface that includes a second mechanical coupler and a second electrical coupler configured to electrically couple the first electronic component, the first chassis component, the second electronic component, or the second chassis component to a second end of the electrically conducting path.

Assembly for chassis electrical and mechanical right-angle connection

Phased array antennas, such as a multi-function aperture, are limited in performance and reliability by traditional air-cooled thermal management systems. A fuel-cooled multi-function aperture passes engine fuel through heat exchangers that surround the multi-function aperture to provide better heat transfer than can be achieved through air cooling systems. The increased heat transfer and thermal management results in a multi-function aperture with improved performance and reliability.

Fuel cooled multi-function aperture

A system is disclosed that includes an electronic package. The electronic package includes a package base couplable to a host substrate, and a package lid mechanically coupled to the package base that includes one or more transparent lid areas, configured to permit transmission of light. The electronic package further includes a thermal spreader bonded on a first side to a first side of the package lid. The thermal spreader includes one or more transparent spreader areas that are configured to allow transmission of light through the thermal spreader. The electronic package further includes one or more integrated circuits bonded to a second side of the thermal spreader that communicatively coupled to the host substrate. The electronic package further includes one or more optical paths that include at least one of the one or more transparent spreader areas configured adjacent to at least one of the transparent lid areas.

Optically clear thermal spreader for status indication within an electronics package

A semiconductor package system is disclosed. The system includes a first interposer and a first integrated circuit die electrically coupled and thermally coupled to a first side of the first interposer. The system further includes a second integrated circuit die electrically coupled and thermally coupled to a second side of the first interposer. The system further includes a ring carrier electrically coupled and thermally coupled to the first interposer. The ring carrier is configured to transmit an input to the first interposer. In some embodiments, the system further includes at least one thermal spreader thermally coupled to the ring carrier and at least one of the first integrated circuit, the second integrated circuit, or the first interposer.

Microelectronics package with enhanced thermal dissipation

A method for fabricating semiconductor die with die-attach preforms is disclosed. In embodiments, the method includes: applying an uncured die-attach paste material to a surface of a forming substrate to form one or more die-attach preforms, the surface of the forming substrate formed from a hydrophobic material; curing the one or more die-attach preforms; performing one or more planarization processes on the one or more die-attach preforms; coupling a first surface of a semiconductor die to a handling tool; and bonding a second surface of the semiconductor die to at least one die-attach preform of the one or more die-attach preforms.

System and method for extreme performance die attach

A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.

Alkali silicate glass based coating and method for applying

Provided in one embodiment is an article, comprising: a glass material; and an antiglare material covering at least partially the glass material; wherein the antiglare material comprises at least one alkali silicate.

Antiglare treatment for glass

A composition of matter is configured for use as at least a part of an energy source when combined with water. The composition of matter includes a metal comprising gallium and aluminum that is alloyed with the metal. The metal comprising gallium is liquid at a room temperature of 70&#xb0; F. and at a standard atmospheric pressure of 14.7 psi.

Methods and materials for use with fuel cells

An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component.

Integrated circuit protection and ruggedization coatings and methods

The present invention is directed to low-cost, low-processing temperature, and simple reinforcement, repair, and corrosion protection for hermetically sealed modules and hermetic connectors. A thin layer of glass is applied over the module's seal or the connector' glass frit. The layer of glass comprises an alkali silicate glass. The layer of glass is produced from a material which is a low viscosity liquid at room temperature prior to curing and is cured at low temperatures (typically no more than about 160 degrees Celsius). Subsequent to curing, the layer of glass is intimately bonded to the seal, watertight, and is stable from about negative two-hundred forty-three degrees Celsius to at least about seven-hundred twenty-seven degrees Celsius. The glass layer provides corrosion protection, seals any existing leaks, and possesses good flexibility and adhesion. The resulting bond is hermetic with good aqueous durability and strength similar to that of monolithic structures.

Method of reinforcing a hermetic seal of a module

Growing community of inventors

Cedar Rapids, IA, United States of America

Ross Keith Wilcoxon