International Business Machines Corporation

Ross Downey Havens

Robert Maynard Japp

Mark David Poliks

Voya Rista Markovich

Jeffrey Alan Knight

Jaynal Abedin Molla

Perminder S Bindra

Kostas I Papathomas

Bernd Karl Appelt

William Thomas Fotorny

Lawrence Robert Blumberg

Amarjit S Rai

Jan Obrzut

Anne Marie Quinn

Anne M Quinn, Deceased

The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrically connecting the substrate to an external circuitized substrate. In one version, the method comprises covering substantially all of the external surfaces of the substrate, the semiconductor chip and a portion of the plurality of conductors with a protective covering from immersion in a dielectric solution (e.g., TEFLON AF). The coatings can also be applied by brushing, spraying, or chemical vapor deposition. In an alternative embodiment, all of the external surfaces, including all of the conductors, are coated with the protective covering (e.g., to facilitate package shipment or other handling). The resulting electronic packages are also described herein.

Electronic package utilizing protective coating

A fabric material and method of its manufacture suitable for use in electronic packages including chip carriers. High insulation resistance is exhibited when subjected to high temperatures and humidity stress conditions.

Laminate and method of manufacture thereof

Method for providing a protective coating and electronic package

Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.

Interconnection method and structure for organic circuit boards

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Endicott, NY, United States of America

Ross Downey Havens