Dow Corning Corporation

Ross A Noel

Randall P Sweet

Loren D Durfee

Katherine L Ulman

Hot-melt silicone pressure sensitive adhesive compositions containing organic waxes, methods of using the compositions and devices made using the compositions are disclosed. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicate resin, (ii) a silicone fluid, and (iii) an organic wax having a melting point of between 30.degree. C. and 150.degree. C. The organic wax decreases dynamic viscosity of the adhesive at temperatures equal to or below about 200.degree. C.

Silicone pressure sensitive adhesive containing organic wax

Hot-melt silicone pressure sensitive adhesive compositions containing alkylmethylsiloxane waxes and methods of using the compositions are disclosed. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicate resin, (ii) a silicone fluid, and (iii) an alkylmethylsiloxane wax having a melting point of between 30.degree. C. and 70.degree. C. The alkylmethylsiloxane wax decreases dynamic viscosity of the adhesive compositions at temperatures ranging from about 50.degree. C. to about 200.degree. C.

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Midland, MI, United States of America

Ross A Noel