Infineon Technologies Ag

Roslie Saini Bin Bakar

Chau Fatt Chiang

Chee Hong Lee

Pei Luan Pok

Swee Kah Lee

Kok Yau Chua

Stefan Helmut Schmalzl

Werner Josef Reiss

Soon Lee Liew

Hock Heng Chong

Nurfarena Othman

Hsieh Ting Kuek

Yean Seng Ng

Yu Shien Leong

Junny Abdul Wahid

Jan Sing Loh

Kon Hoe Chin

April Coleen Tuazon Bernardez

A method for fabricating an electronic device includes providing an encapsulant having an encapsulation material, providing a first laser beam and forming a trench into a main surface of the encapsulant by removing the encapsulation material by means of the first laser beam, forming a mask along a portion above the edge of the trench, and providing a second laser beam and sweeping the second laser beam over a surface area of the main surface of the encapsulant, wherein the surface area covers at least an area spatially confined by the trench.

Dual step laser processing of an encapsulant of a semiconductor chip package

Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.

Semiconductor package with air cavity

Growing community of inventors

Melaka, Malaysia

Roslie Saini Bin Bakar