Ascent Solar Technologies, Inc.

Itn Energy Systems, Inc.

Itn Energy System, Inc.

Rosine M Ribelin

Lawrence M Woods

Joseph H Armstrong

Prem Nath

Bizhong Zhu

Dimitris Katsoulis

Michitaka Suto

Maki Itoh

Thomas Duncan Barnard

Herschel Henry Reese

Hidekatsu Hatanaka

Yukinari Harimoto

Nicole Anderson

A multi-junction photovoltaic cell includes a substrate and a back contact layer formed on the substrate. A low bandgap Group IB-IIIB-VIBmaterial solar absorber layer is formed on the back contact layer. A heterojunction partner layer is formed on the low bandgap solar absorber layer, to help form the bottom cell junction, and the heterojunction partner layer includes at least one layer of a high resistivity material having a resistivity of at least 100 ohms-centimeter. The high resistivity material has the formula (Zn and/or Mg)(S, Se, O, and/or OH). A conductive interconnect layer is formed above the heterojunction partner layer, and at least one additional single-junction photovoltaic cell is formed on the conductive interconnect layer, as a top cell. The top cell may have an amorphous Silicon or p-type Cadmium Selenide solar absorber layer. Cadmium Selenide may be converted from n-type to p-type with a chloride doping process.

Hybrid multi-junction photovoltaic cells and associated methods

A method for depositing one or more thin-film layers on a flexible polyimide substrate having opposing front and back outer surfaces includes the following steps: (a) heating the flexible polyimide substrate such that a temperature of the front outer surface of the flexible polyimide substrate is higher than a temperature of the back outer surface of the flexible polyimide substrate, and (b) depositing the one or more thin-film layers on the front outer surface of the flexible polyimide substrate. A deposition zone for executing the method includes (a) one of more physical vapor deposition sources adapted to deposit one or more metallic materials on the front outer surface of the substrate, and (b) one or more radiant zone boundary heaters.

Systems and methods for thermally managing high-temperature processes on temperature sensitive substrates

In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.

Reinforcing structures for thin-film photovoltaic device substrates, and associated methods

A thin-film photovoltaic device includes a semi-transparent back contact layer. The semi-transparent back contact layer includes a semi-transparent contact layer and a semi-transparent contact interface layer. The thin-film photovoltaic device may be formed in a substrate or superstrate configuration. A tandem thin-film photovoltaic device includes a semi-transparent interconnect layer. The semi-transparent interconnect layer includes a semi-transparent contact layer and a semi-transparent contact interface layer.

Systems and processes for bifacial collection and tandem junctions using a thin-film photovoltaic device

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Lakewood, CO, United States of America

Rosine M Ribelin