National Starch and Chemical Investment Holding Corporation

Other

Rose Ann Schultz

Steven P Fenelli

Donald E Herr

Quinn K Tong

Bing T Wu

Chaodong Xiao

Jiazhong Luo

Elizabeth M Walker

Peter J Schlom

Katharine Louise Pearce

Ju-Ming Hung

James W Nowicki

Nikola A Nikolic

Brian S Huffman

Charles Willard Paul

Sharon Chaplinsky

S Steve Chen

Scott R McLaughlin

Pingyong Xu

The present invention is directed to nitrile-oxide precursor compounds, and their preparation and use as an irreversible cross-linking agent in polymers having appropriate functionality, i.e., alkenes, alkynes nitriles, and isocyanates. The present invention is also directed to the use of nitrile oxide compound in filled or unfilled applications such as pressure sensitive adhesives, reactive hot melts, polyurethane dispersions, thermosetting adhesives, thermoplastic adhesives or coatings.

Reagents for heat activated polymer crosslinking

A cross-linkable and cross-linked organosilicon polymer which is prepared from a mixture of a reactive polysiloxane resin having both reactive carbon-carbon double bonds and silicone-hydrogen groups, characterized by alternating structures of polycyclic polyene residue and cyclic (or tetrahedral) polysiloxane residue, and either vinyl terminated fluorine-containing polysiloxane or vinyl terminated phenyl-substituted siloxane. In an alternative embodiment, the polymer comprises a mixture of vinyl terminated phenyl-substituted polysiloxane and vinyl functional fluorosilicone elastomer with the cross-linkable and cross linked organosilicon polymer.

Fluid resistant silicone encapsulant

Allylated amide compounds are formulated into curable compositions with a free radical curing agent, and optionally, one or more fillers, for use as adhesives in the manufacture of microelectronic devices.

Allylated amide compounds and die attach adhesives prepared therefrom

The present invention is directed to nitrile-oxide precursor compounds, and their preparation and use as an irreversible cross-linking agent in polymers having appropriate functionality, i.e., alkenes, alkynes nitrites, and isocyanates. The present invention is also directed to the use of nitrile oxide compound in filled or unfilled applications such as pressure sensitive adhesives, reactive hot melts, polyurethane dispersions, thermosetting adhesives, thermoplastic adhesives or coatings.

This invention relates to underfill encapsulant compositions prepared from allylated amide compounds to protect and reinforce the interconnections between an electronic component and a substrate in a microelectronic device.

Underfill encapsulants prepared from allylated amide compounds

Underfill encapsulants are prepared from allylated amide compounds and a curing initiator.

A thermoplastic or thermosetting curable adhesive composition for bonding an electronic component to a substrate in which the adhesive is cured in situ comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.

Die attach adhesives for use in microelectronic devices

Radiation- or thermally-initiated cationically-curable compounds based on styrene oxide moieties are linked to organic molecules, oligomers or polymers.

Radiation- or thermally-initiated cationically-curable epoxide compounds

Radiation- or thermally-initiated cationically-curable styrene oxides of the structure ##STR1## are suitable for use in cationically curable adhesive and coating compositions.

Reactive radiation- or thermally-initiated cationically-curable epoxide

This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities, and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers, and a phenolic hardener.

Snap-cure epoxy adhesives

This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers.

A process for the degradation of starch, particularly granular starch, using hydrogen peroxide and a catalytic amount of a metal-based coordination complex in an alkaline slurry reaction.

Starch degradation using metal-based coordination complexes

This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities.

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Princeton, NJ, United States of America

Rose Ann Schultz