Bae Systems Information and Electronic Systems Integration Inc.

Rosanne H Tinkler

Neal R Butler

Allen W Hairston

Richard J Blackwell, Jr

Menahem Lowy

A 3D wafer-integration uncooled infrared (IR) microbolometer focal plane array (FPA) sensor includes a first die with an FPA of uncooled IR microbolometers, a second die signal-processing layer. The dies are vertically aligned, stacked with 3D wafer bonding, and interconnected. Interconnection include vertical electrical interconnects. Separate optimized manufacturing processes are used for die, so that additional processing costs of the FPA die are leveraged and 3D integration is completed at wafer level, minimizing total device cost and maximizing die count per wafer.

3D stacked uncooled IR sensor device and method

An imaging system configured with readout circuit redundancy is disclosed. Pixel data from a particular column can be steered around a defective readout circuit to an operational readout circuit. Thus, larger imaging arrays which are generally more prone to common column circuitry defects are enabled. In addition, imaging systems configured with significant on-chip signal processing, which are also more prone to common column circuitry defects, are enabled. The occurrence of lost pixel data from an entire column is eliminated or otherwise reduced, thereby increasing overall operability and yield of the imaging system. The system can be implemented on a single chip or a chip set.

Substitution of defective readout circuits in imagers

A high-speed serial interface for focal plane arrays (FPAs), such as microbolometer and cooled FPAs, is disclosed. The interface uses a serial low-voltage differential signal that is substantially unsusceptible to digital crosstalk and EMI, and provides power dissipation that is signal-independent.

Focal plane array with on-chip low-voltage differential serial interface

Methods and apparatus for controlling critical races in sequential circuits so that the there are no conflicts when two or more different data signals exists on shared circuit paths. This enables the design and implementation of sequential circuits having fewer gates than conventional circuit designs of equivalent function that translates into smaller area and power consumption. The control of the critical race is accomplished by adjusting the relative delay of the individual sections of one or more loops.

Growing community of inventors

Lexington, MA, United States of America

Rosanne H Tinkler