Valeo North America, Inc.

Rosangela Loiudice

Shivi Singh

Thomas Nolan

A magnetron sputtering apparatus includes a first independent sputtering target power supply, a second independent sputtering target power supply, a process gas port, a reactive gas port, a vacuum chamber configured to house the first independent sputtering target power supply, the second independent sputtering target power supply, the process gas port, the reactive gas port, and a platform for placing a part for deposition of a coating by the magnetron sputtering apparatus, and processing circuitry. The processing circuitry is configured to alternately sputter a first target and a second target by alternately switching between the first independent sputtering target power supply and the second independent sputtering target power supply, respectively, and control one or more process parameters to yield a predetermined color of the coating deposited onto the part.

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Seymour, IN, United States of America

Rosangela Loiudice