Raytheon Company

Rosalio S Vidaurri

Alberto F Viscarra

David T Winslow

Ethan Santosh Heinrich

Kevin C Rolston

Melvin S Campbell

Christopher R Koontz

Charles Chu

Keith R Burrell

Andrew J Bristol

Kevin A Miyamoto

An apparatus includes a thermal spreader configured to remove thermal energy from a device to be cooled. The thermal spreader includes a ringframe having an opening, where the opening is configured to provide access to the device through the ringframe. The thermal spreader also includes a pair of thermal straps configured to fit within the opening. The pair of thermal straps is configured to be bonded to the device and to be fastened to the ringframe in order to provide the thermal energy from the device to the ringframe.

Thermal spreader including ringframe and thermal straps for thermal dissipation in space and other applications

An apparatus for cooling semiconductor elements uses heat exchangers to transfer heat from the semiconductor elements to a coolant flowing through the heat exchangers. A central body, made from a flexible material, is positioned between the heat exchangers and a manifold from which the coolant is provided. The central body includes a plurality of flexible runners fluidly coupled to each heat exchanger and the manifold to provide the coolant to the heat exchanger. Heat is transferred away from the semiconductor elements by the coolant and heated coolant is returned from the heat exchanger to the manifold. Each flexible runner is configured to flex to conform to a height of a respective semiconductor element and thereby apply a force to the heat exchanger to maintain contact with the semiconductor element.

Semiconductor cooling apparatus

A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.

Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle

Process for fabricating an origami formed antenna radiating structure

Growing community of inventors

Los Angeles, CA, United States of America

Rosalio S Vidaurri