Micronit Microfluidics B.v.

Ronny Van 't Oever

Marko Theodoor Blom

Jeroen Haneveld

Johannes Oonk

Marinus Bernardus Olde Riekerink

Peter Tijssen

Amitava Gupta

Jean-Christophe Roulet

Jean-Noël Fehr

Wilfred Buesink

Arenda Hendrika Jacoba Koelewijn-Hubers

Hendrik Jan Hildebrand Tigelaar

A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Rof less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

Method for forming an electrically conductive via in a substrate

The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply. The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.

Method for manufacturing microfluidic chips, device for functionalizing microfluidic chips, microfluidic chip and device for holding a microfluidic chip

The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Method of bonding two substrates and device manufactured thereby

Aspects of the invention include methods and devices for manufacturing and testing microfluidic chips having at least one capillary for through-flow of a fluid.

Method for manufacturing and testing micro fluidic chips

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Epse, Netherlands

Ronny Van 't Oever