Kla Tencor Corporation

Zeta Instruments, Inc.

Candela Instruments

Kla-tencor Technologies Corporation

Ronny Soetarman

Rusmin Kudinar

Steven W Meeks

James Jianguo Xu

Hung Phi Nguyen

Ken K Lee

Zhen Hou

Vamsi Mohan Velidandla

Anoop K Somanchi

James Nelson Stainton

William R Wheeler

Ben Garland

Budi Hartono

Dave S Oak

Tri Do

Nitigya Kathuria

Jimmy Leung

Anoop Somanchi

Vamsi Velidandla

A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).

3D microscope including insertable components to provide multiple imaging and measurement capabilities

A dual mode inspector includes an optical inspector configured to detect a defect located at a first location on a sample, a microscope configured to capture an image of the defect at the first location on the sample, and a platform that is configured to support the sample. The sample is not removed from the platform between the detecting of the defect located at the first location on the sample and the capturing of the image of the defect at the first location on the sample. The dual mode optical inspector also includes a controller that causes the optical inspector to detect the defect located at the first location on the sample and causes the microscope to capture the image of the defect at the first location on the sample. The dual mode inspector also performs scanning lens distortion correction to improve the capturing of defect images.

Dual mode inspector

A method of generating 3D information includes: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps, capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across all pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of the sample is present at each pre-determined step; determining a first captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image; determining a second captured image that is focused on a second surface of the sample based on the characteristic value of each pixel in each captured image; and determining a first distance between the first surface and the second surface.

Optical measurement of step size and plated metal thickness

A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.

Method and apparatus to detect defects in transparent solids

A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.

3D microscope and methods of measuring patterned substrates

A method of generating 3D information including: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps; capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across a first portion of pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of the sample is present at each pre-determined step; determining a first captured image that is focused on an apex of a bump of the sample; determining a second captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image; and determining a first distance between the apex of the bump and the first surface.

Optical measurement of bump hieght

A method of generating 3D information of a sample using an optical microscope includes: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps, capturing an image at each pre-determined step, determining a characteristic value of each pixel in each captured image, determining a first captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image, and determining a measurement of an opening in the first surface of the sample based on the first captured image. The first surface of the sample and the second surface of the sample are within a field of view of each of the captured images. The first captured image includes a pattern overlay. In another example, the opening measurement is determined using a second captured image without a pattern overlay.

Optical measurement of opening dimensions in a wafer

An optical inspector includes a time varying beam reflector, a radiating source that irradiates the time varying beam reflector, a telecentric scan lens configured to direct the radiation reflected by the time varying beam reflector onto a first surface of a transparent sample, a first detector that receives at least a portion of top surface specular reflection, a second detector that receives at least a portion of the bottom surface specular reflection. A turning mirror may also be included. The turning mirror is a switchable mirror that can be adjusted to a first position where the turning mirror reflects the top and bottom surface specular reflection, and can be adjusted to a second position where the turning mirror does not reflect the top or the bottom surface specular reflection. A first and second polarizing element may also be included to detect additional types of defects on either surface.

Multi-surface specular reflection inspector

A method for detecting defects includes directing a scanning beam to a location on a surface of a transparent sample, measuring top and bottom surface specular reflection intensity, and storing coordinate values of the first location and the top and bottom surface specular reflection intensity in a memory. The method may further include comparing the top surface specular reflection intensity measured at each location with a first threshold value, comparing the bottom surface specular reflection intensity measured at each location with a second threshold value, and determining if a defect is present at each location and on which surface the defect is present. The method may further include comparing the top surface specular reflection intensity measured at each location with a first intensity range, comparing the bottom surface specular reflection intensity measured at each location with a second intensity range, and determining on which surface the defect is present.

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Fremont, CA, United States of America

Ronny Soetarman