Infineon Technologies Ag

Ronny Herms

Thomas Auer

Thomas Duetemeyer

Georg Braeker

A semiconductor module includes a module housing, at least one substrate, a number N of at least two controllable power semiconductor chips arranged inside the module housing and one after another in a lateral direction, a single main load terminal arranged outside the module housing and electrically connected to the first main electrodes, and an auxiliary terminal arranged outside the module housing and electrically connected to the first main electrodes via an auxiliary terminal connecting conductor.

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Munich, Georgia

Ronny Herms