Emcore Corporation

Rongsheng Miao

Leo Kha

Genzao Zhang

Bryon Lynn Kasper

Xiaoming Lou

Xin Simon Luo

Nghia Kha

Todd Edward Olson

Matthew Swass

An adapted semiconductor laser package that may convert a first type of package pin-out arrangement to a desired pin-out arrangement. The laser package may include a laser package including a laser, an isolator, a lens, a fiber sleeve, and a pin-out arrangement. The isolator and the fiber sleeve may be jointly arranged away from the laser. The laser package may also include an adapter with a first section with a plurality of holes geometrically arranged and mated with the package pin-out arrangement, a second section with an adapter pin-out arrangement with two rows of pins extending along opposite sides of the package, and electrical connections between the plurality of holes and the pins.

Adapted semiconductor laser package

A laser module including a first housing which encloses a semiconductor laser device, a support, a fiber sleeve for holding an optical fiber, a lens, and an isolator. The isolator and the fiber sleeve are jointly arranged within a second housing which is an integral holder holding both the isolator and the fiber sleeve.

Laser module including jointly arranged isolator and fiber sleeve

An opto-electric module adapted to be coupled with an optical fiber on a first side and a plurality of electrical conductors on a second side. The opto-electric module includes a header with a plurality of pins extending through the header a thermo-electric cooler with a hot plate of the thermo-electric cooler disposed against a second, opposing side of the header and a plurality of active and passive optical components adapted to convert between an optical signal format within the optical fiber and an electrical signal format within at least one conductor of the plurality of conductors, said plurality of active and passive optical components all being in thermal contact with a cold plate of the thermo-electric cooler.

Coaxial cooled laser modules with integrated thermal electric cooler and optical components

An optical fiber bonding scheme provides improved bonding properties and improved lifetime for non-hermetic fiber optic packages such as OSAs. The bonding scheme includes an optical fiber bonded to a substrate surface with an epoxy and a diffusion retarding plate covering the epoxy. The diffusion retarding plate prevents moisture absorption by the top surface of the epoxy and the large footprint of the epoxy provides a long diffusion path which produces a lower water concentration gradient within the epoxy, restricts lateral diffusion of absorbed water molecules within the epoxy, and produces an extremely saturation resistant epoxy. The diffusion retarding plate may further include legs that bound opposed sides of the epoxy providing further saturation resistance.

Strength added epoxy fiber bonding in non-hermetic fiber optic packaging

An optical thick film formed on a photodetector improves the optical coupling efficiency between the optical fiber and photodetector which are optically coupled. The optical thick film has a refractive index that is between the refractive index of air and the refractive index of photodetector upon which the optical matching coating is disposed. Silicone may advantageously be formed as the optical thick film coating on the photodetector.

Growing community of inventors

El Monte, CA, United States of America

Rongsheng Miao