Kelvin Thermal Technologies, Inc.

University of Colorado

University of Wyoming

Other

Massachusetts Institute of Technology

Kevlin Thermal Technologies, Inc.

Ronggui Yang

Yung-Cheng Lee

Ryan John Lewis

Victor M Bright

Christopher Oshman

Shanshan Xu

Chen Li

Bo Shi

George P Peterson

Jen-Hau Cheng

Li-Anne Liew

Xiaobo Yin

Gang Tan

Dongliang Zhao

Yaoguang Ma

Yao Zhai

Ching-Yi Lin

Collin Jennings Coolidge

Gang Paul Chen

Rongfu Wen

Xiaoyuan Chen

Jen- Hau Cheng

Arvind Narayanaswamy

Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.

Thermal management planes

A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

Micropillar-enabled thermal ground plane

This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. In some instances, the single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

Single and multi-layer mesh structures for enhanced thermal transport

Some embodiments of the invention include a thermal ground plane with a variable thickness vapor core. For example, a thermal ground plan may include a first casing and a second casing where the second casing and the first casing configured to enclose a working fluid. The thermal ground plane may also include an evaporator region disposed at least partially on at least one of the first casing and the second casing; a condenser region disposed at least partially on at least one of the first casing and the second casing; and a wicking layer disposed between the first casing and the second casing a vapor core defined at least partially by a gap between the first casing and the second casing. The thickness of the gap can vary across the first casing and the second casing.

Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems

This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures, and a cold collection system comprising a plurality of the polymer-based selective radiative cooling structures.

Radiative cooling structures and systems

A process for fabricating a thermochromic film is disclosed which includes the steps of dispersing a predetermined amount of vanadium dioxide (VO) nanoparticles in a predetermined amount of poly(methyl methacrylate) (PMMA), stirring a mixture thereof for a first predetermined amount of time, generating cross-links to molecule chains of the PMMA in the mixture, and blade coating a predetermined thickness of the cross-linked mixture on a substrate to form the thermochromic film.

Durability-enhanced thermochromic film and method of manufacturing same

A retrofitted window is disclosed which includes a substantially transparent aerogel film laminated on a glass windowpane, the aerogel film being embedded with randomly dispersed nanoparticles of vanadium dioxide (VO) core and silicon dioxide (SiO) shell, wherein the vanadium dioxide (VO) core transitions between an insulator phase and a metal phase at a predetermined phase-transition temperature, and a volume fraction of the nanoparticles in the aerogel film is approximately between 0.001% and 0.05%.

Optically-switchable thermally-insulating VO-aerogel hybrid film for window retrofits

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Thermal ground plane

A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.

A thermal ground plane with hybrid structures that include nanowires is disclosed. The thermal ground plane includes a first casing having an exterior surface and an interior surface, the interior surface includes plurality of microstructures with a plurality of nanowires; a second casing, wherein the first casing and the second casing are sealed to an interior space that includes a working fluid; and a wicking layer disposed within the interior space.

Method and device for spreading high heat fluxes in thermal ground planes

Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.

Growing community of inventors

Broomfield, NY, United States of America

Ronggui Yang