Motorola Corporation

Other

Freescale Semiconductor,inc.

Rong-Fong Huang

Jeremy W Burdon

Huinan J Yu

Piotr Grodzinski

Cynthia G Briscoe

Richard S Kommrusch

Carlos Anthony Sanchez

Robert Marrero

Dean Robert Anderson

Xunhu Dai

John C Estes

Joyce K Yamamoto

David Wilcox

James H Lombard

Nicholas J Naclerio

Chia-Yu Fu

Craig S Amrine

Barbara M Foley

Wei-Yean Howng

Wang-Chang A Gu

Darioush Agahi-Kesheh

Peter A Smith

Thomas Allen Wetteroth

Scott K Ageno

Rickey G Pastor

Sean Gallagher

Robert A Burr

Yuk-Tong Chan

Cynthia Ann Gorsuch Briscoe

Rich Kommrusch

Ming-Yih Su

Michael W Murphy

A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.

Low profile integrated module interconnects and method of fabrication

A multilayered microfluidic DNA analysis system includes a cell lysis chamber, a DNA separation chamber, a DNA amplification chamber, and a DNA detection system. The multilayered microfluidic DNA analysis system is provided as a substantially monolithic structure formed from a plurality of green-sheet layers sintered together. The substantially monolithic structure has defined therein a means for heating the DNA amplification chamber and a means for cooling the DNA amplification chamber. The means for heating and means for cooling operate to cycle the temperature of the DNA amplification chamber as required for performing a DNA amplification process, such as PCR.

Multilayered microfluidic DNA analysis system and method

A micro-gas chromatograph column is formed by texturing a channel into a plurality of green-sheet layers, which are then sintered together to form a substantially monolithic structure. A thick-film paste may be added to the channel textured in the green-sheet layers to provide a porous plug sintered in the micro-gas chromatograph column in the substantially monolithic. A thermal conductivity detector is formed in the substantially monolithic structure by depositing a conductive thick-film paste on the surface of one of the green-sheet layers to define a resistor in an exit channel of the micro-gas chromatograph column.

Multilayered ceramic micro-gas chromatograph and method for making the same

A method for fabricating a multilayered structure out of sheets of green-tape without the application of high pressures includes the step of applying an adhesive to the sheets of green-tape. Selection of an adhesive with a polymer that decomposes at a higher temperature than the binder present in the green-tape promotes stability of the interfaces during the firing process and promotes void-free sintering within the interfacial regions. A multilayered structure with internal electrical conduction pathways and with internal vias, channels, and cavities may be fabricated by this method

Method for fabricating a multilayered structure and the structures formed by the method

A multilayered microfluidic device having a substantially monolithic structure is formed by sintering together a plurality of green-sheet layers. The substantially monolithic structure has an inlet port for receiving fluid, an outlet port for releasing fluid, and an interconnection between the inlet port and the outlet port. The substantially monolithic structure may also include a variety of components to enable useful interaction with the fluid, such as electrically conductive pathways, heaters, fluid sensors, fluid motion transducers, and optically transmissive portions. The components are preferably fabricated using thick-film or green-sheet technology and are preferably co-fired with and sintered to the green-sheet layers to become integral with the substantially monolithic structure.

Integrated multilayered microfludic devices and methods for making the same

Low profile interconnect structure includes an electronic circuit module with a plurality of mounting areas and a plurality of electrical contact areas defined by the mounting surface. The plurality of mounting areas are spaced a first distance from a mounting and interconnect surface parallel to and spaced from the mounting surface and the plurality of electrical contact areas are spaced a second distance, less than the first distance, from the mounting and interconnect surface. Large solder balls are used between the mounting areas and the mounting and interconnect surface to form a solid mount and smaller solder members are used for electrical interconnections.

Low profile interconnect structure

A multiphase dielectric composition for a multilayered ceramic device ( ), and devices incorporating the same, including a (SrCa)TiO dielectric powder and a glass that is substantially free of lead having a weight ratio of about 35 to about 65 parts powder: about 65 to about 35 parts glass, and having a particle size of about 1 to about 2.5 micron (um) and having a dielectric constant (K) of about 18 to about 30 and an electrical Q of at least about 300 to about 550.

Multiphase dielectric composition and multilayered device incorporating the same

A multilayer ceramic integrated circuit module for a receiver front-end of a wireless communication device is provided. The module contains an embedded component portion, which has a plurality of thick film capacitors; a plurality of multilayer capacitors; and a plurality of transmission lines deposited internal to the multilayer ceramic integrated circuit module to interconnect the plurality of thick film capacitors and the plurality of multilayer capacitors. The module also contains a mounted component portion, which has a pair of pin diodes; a transistor and a plurality of resistors coupled thereto, for controlling the bias of the pair of pin diodes; and a low-noise-amplifier. The module reduces the size and weight of wireless devices and combines multiple functions into a highly integrated device.

Integration of a receiver front-end in multilayer ceramic integrated circuit technology

A multilayer electronic component (200) is provided. The component includes a substrate package assembly (202) with a set of stacked insulated sheets of a dielectric ceramic material (204, 206, 208, 210, 212). Also included are a set of embedded resistors (214), each of the embedded resistors including an electrical input port pad (216) and an electrical output port pad (218) provided in layers between the set of stacked insulated sheets. Each of the insulated sheets has a trough (220) of a predetermined length aligned between and transverse to the electrical input port pad (216) and the electrical output port pad (218). The trough (220) reduces the resistance value variability in the multilayer electronic component (200). The trough (220) is substantially filled with a resistive paste material and an internal circuit (222) connects the embedded resistors inside the substrate package assembly (202). A method of forming the substrate package assembly (202) is also provided.

Multilayer ceramic package with low-variance embedded resistors

A field emission display (100) includes a cathode plate (102) having a plurality of electron emitters (124), an anode plate (104) opposing the cathode plate (102), and a bulk-resistive spacer (108) extending between the anode plate (104) and the cathode plate (102). The bulk-resistive spacer (108) is made from an electrically conductive material. The resistivity of the electrically conductive material is selected to remove impinging charges while preventing excessive power loss due to electrical current through the bulk-resistive spacer (108) from the anode plate (104) to the cathode plate (102).

Field emission device having a non-coated spacer

Multiphase ceramic materials for use in electronic applications such as patch antennas and multilayered ceramic devices may be fabricated by providing a novel combination of a glassy precursor material with operable amounts of a high purity cordierite material. The combined materials are sintered at appropriate temperatures, so that a non-glassy celsian type phase is formed. The materials of the instant invention, fabricated according to the method disclosed herein, demonstrate low dielectric constant (K) and low electrical loss (high Q) characteristics.

Ceramic composition with low dielectric constant and method of making

A dielectric paste material may be used in the fabrication of multilayered ceramic modules to create circuit elements. The dielectric paste is a multiphase material in which at least one phase is an alkaline earth metal, transition metal silicate. This yields a dielectric paste with extremely good K & Q values suitable for high frequency applications which significantly reduce manufacturing costs of modules.

Low temperature cofireable dielectric paste

A method for producing input/output connections in a ceramic device is disclosed. The ceramic device can provide wraparound input/output connections. The method can include first providing first and second green ceramic layers, forming at least one via in each ceramic layer, the at least one via in the second layer being offset from and connecting to the via in the first ceramic layer, filling the vias with metallization, laminating the ceramic layers to form a laminate, scoring the laminate along at least one line extending through the first via and into a portion of the second ceramic layer such that the line does not intersect the at least one second via the ceramic laminate and metalization, and cleaving the laminate along the scored line. A ceramic device using this method can provide a wraparound connection extending partially up the side thereof, which can be advantageous in many multi-layer applications.

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Tempe, AZ, United States of America

Rong-Fong Huang