Motorola Corporation

Rong F Huang

Richard S Kommrusch

Wei-Yean Howng

John C Estes

Jeremy W Burdon

James H Lombard

An intermediate low-pressure laminated ceramic device is formed from a plurality of layers of unfired ceramic material each including ceramic particles in an organic binder. A polymer interfacial layer having a glass transition temperature such that it flows at a temperature below a temperature required for the unfired ceramic layers to substantially deform, is deposited on one surface of each of the unfired ceramic layers. The unfired ceramic layers are stacked with an interfacial layer positioned between adjacent unfired ceramic layers in the stack. The stack is heated to a temperature greater than the glass transition temperature of the interfacial layers and a pressure is applied to the heated stack below approximately 1200 psi to fixedly bond the plurality of layers in the stack together.

Low pressure laminated ceramic devices and method

A laminated lowpass filter (100) is disclosed. The filter (100) has: a stack of dielectric substrates (301-312) having a ground via (118); a pi network coupled between an input (202) and an output (202'); a first leg comprising a first transmission line (608) and a first capacitance (C1) connected to a top ground plane (GP1); a second leg comprising a second transmission line (608') and a second capacitance (C2) connected to a bottom ground plane (GP2); a middle leg including a transmission line (606) is between the first and second leg; the single point ground plane configuration prevents ground loops and minimizes the passage of stray signals through the laminated lowpass filter (100).

Multilayer lowpass filter with single point ground plane configuration

A high adhesion strength, co-fireable, solderable silver metallization material for use with low-fire ceramics is provided. The metallization material includes the metallization powder as well as a binder vehicle, and an adhesion promoting agent. The combination of elements allows a metallization material which can be cofired at relatively low temperatures necessary for firing ceramic substrate materials while providing an adequate base for soldering subsequent circuit components to the ceramic substrate.

High adhesion, solderable, metallization materials

An Ytrium Barium Copper Oxide-based thick-film paste is disclosed, which when deposited on an alumina substrate is superconducting above the termperature of liquid nitrogen and substantially free of mechanical defects such as cracking or peeling. A method of applying the paste, including the curing process, insures that the YBC superconductor is boned to the substrate.

Superconducting thick film

Ceramic dielectric substrates, calcium titanate, bismuth titanate and strontium titanate, used with superconductor, Ytrium Barium Copper Oxide, or YBC, as an electrode, produce a superconducting electrical device, useable as a filter or capacitor. The electrical device formed by using one of the dielectrics taught herein in combination with YBC, is mechanically stable in comparison to prior art ceramic dielectrics that used YBC for an electrode material, in that the YBC is substantially free of microcracks and remains bonded to the substrates.

Growing community of inventors

Albuquerque, NM, United States of America

Rong F Huang