Foxconn Technology Co., Ltd.

Rong-Che Chen

Chien-Yi Lo

Chih-Hao Yang

Yuh-Ching Chang

Yih-Jong Hsieh

Richard Tseng

A cooling device includes a heat sink (), a fan (), and a fan duct () covering the heat sink and fan therein. The heat sink includes a base () defining at least a through hole () at each of two opposite sides thereof. The fan duct comprises a top wall () and two side walls (). A mounting portion () extends outwardly from a bottom of each side wall and has at least a tube () defining a mounting hole () in an outer wall thereof. A plurality of pins () extends through the through holes into the tubes. The pins have retaining rings () abutting against a bottom surface () of the base of the heat sink, and hooks () locked in the mounting holes.

Cooling device for heat-generating electronic component

A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

Growing community of inventors

Guangdong, China

Rong-Che Chen