Hon Hai Precision Industry Co., Ltd.

Hewlett-packard Development Company, L.P.

Rong-Che Chen

Phu Truong

Harold Miyamura

An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.

Heat sink attachment

A heat dissipating assembly for electronic components mounted on a circuit board includes a first thermal plate ( ), a second thermal plate ( ), and a copper adjusting screw ( ). The first thermal plate forms a plurality of offset portions ( ) and thereby defines a plurality of recesses at the offset portions respectively. Depths of the recesses correspond to heights of the electronic components. The first and second thermal plates are secured to opposite sides of the circuit board. The first and second thermal plates respectively define first and third holes ( ) movably receiving the adjusting screw therein. The adjusting screw is tightened so that it improves thermal contact between the offset portions and the electronic components. Because the adjusting screw is made of highly heat conductive material, heat in the first thermal plate is conducted to the second thermal plate through the adjusting screw.

Heat dissipating assembly with thermal plates

A heat sink clip assembly for attaching a heat sink ( ) to a CPU ( ) that is mounted to a mother board ( ). A heat sink clip includes a first bar ( ), a second bar ( ) slidably attached to the bar, and a handle ( ) pivotably attached to the first bar. Two legs ( ) respectively depend from opposite ends of the first and second bars. Two tabs ( ) extend inwardly from the legs, each tab defining a slot ( ). The handle has a shaft ( ) and a pressing cam ( ). A back plate ( ) is placed under the under the mother board. Two post ( ) are successively extended through the back plate, the mother board, and the heat sink. The post are then engaged in the slots of the clip. When the shaft is rotated downwardly, the pressing cam presses against the heat sink.

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Rong-Che Chen