Memjet Technology Limited

Technological Uniersity Dublin

Technological University Dublin

Ronan O'Reilly

Angus John North

Gregory John McAvoy

Misty Bagnat

Brian Seddon

Eithne Dempsey

James Hayes

Baljit Singh

Michael Shnider

Owen Byrne

Darren Hacket

Brian Donohoe

Kim Reid

Alexandra Barcuk

Gregory Mcavoy

A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate. The process includes the steps of: (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface; (ii) forming the inkjet nozzle devices on the frontside surface using MEMS fabrication steps; and (iii) removing the first and second polymers via oxidative ashing, wherein first and second polymers are different.

Process for forming inkjet nozzle devices

A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.

Process for filling etched holes using first and second polymers

A planar micro-reagent cartridge comprises a base layer having a fluid receiving cavity formed in a top surface thereof and a fluid disposed within the cavity, and intermediate layer and a top layer. The intermediate membrane layer is bonded to the base layer to seal the fluid receiving cavity and form a fluid reservoir pump chamber. The intermediate layer comprises a resiliently deformable flexible region that overlies the fluid receiving cavity and is configured to be depressed in response to application of pressure, and a rupturable valve region that overlies the fluid receiving cavity. A top layer is bonded to the intermediate layer, the top layer having an opening that exposes the deformable flexible region of the intermediate membrane layer and at least one channel that together with the intermediate membrane layer forms a fluid conduit having an inlet in fluid communication with the rupturable valve region of the intermediate layer. In use, depression of the deformable flexible region actuates the fluid reservoir pump chamber to rupture the rupturable valve region and pump fluid into the capillary.

Micro-reagent handler and cartridge assembly

A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a photoimageable thermoplastic polymer onto the frontside surface and into each hole; (ii) reflowing the polymer; (iii) selectively removing the polymer from regions outside a periphery of each hole, the selective removing comprising exposure and development of the polymer; (iv) optionally repeating steps (i) to (iii) until each hole is overfilled with the polymer; and (v) planarizing the frontside surface to provide one or more holes filled with a plug of the polymer. Each plug has a respective upper surface coplanar with the frontside surface.

Process for filling etched holes using photoimageable thermoplastic polymer

A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole; (ii) reflowing the first polymer; (iii) exposing the wafer substrate to a controlled oxidative plasma; (iv) optionally repeating steps (i) to (iii); (v) depositing a layer of a photoimageable second polymer; (vi) selectively removing the second polymer from regions outside a periphery of the holes using exposure and development; and (vii) planarizing the frontside surface to provide holes filled with a plug comprising the first and second polymers, which are different than each other. Each plug has a respective upper surface coplanar with the frontside surface.

Process for filling etched holes

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