US Synthetic Corporation

Ronald W Ward

Damon Bart Crockett

Mark Pehrson Chapman

Nicholas Christensen

Debkumar Mukhopadhyay

Kenneth Eugene Bertagnolli

Jair Jahaziel Gonzalez

David Paul Miess

Mohammad N Sani

S Barrett Peterson

Edwin Sean Cox

Robert J Farr

Daniel Preston Wilding

Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining ('EDM'), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.

Method for laser cutting polycrystalline diamond structures

Methods for laser cutting a polycrystalline diamond structure

Embodiments disclosed herein involve polycrystalline diamond ('PCD') tables and polycrystalline diamond compacts ('PDCs') that include PCD tables as well as methods and apparatuses for manufacturing thereof. Some embodiments include a canister assembly that may be used in a high-pressure/high-temperature (&#x201c;HPHT&#x201d;) process or other heating process to manufacture the PCD tables and/or the PDCs.

Methods of fabricating polycrystalline diamond compacts and related canister assemblies

Methods for at least partially relieving stress within a polycrystalline diamond ('PCD') table of a polycrystalline diamond compact ('PDC') include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDCs may include at least one stress relieving partition.

Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both

Bearing assemblies, apparatuses, and motor assemblies using the same are disclosed. In an embodiment, a bearing assembly may include a plurality of superhard bearing elements distributed circumferentially about an axis. Each of the superhard bearing elements may include a bearing surface. At least one of the plurality of superhard bearing elements may include at least one texture feature that may be formed in a lateral surface thereof. The bearing assembly may also include a support ring that carries the superhard bearing elements.

Bearing assemblies, apparatuses, and motor assemblies using the same

Methods for at least partially relieving stress within a polycrystalline diamond ('PCD') table of a polycrystalline diamond compact ('PDC') include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.

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Pleasant Grove, UT, United States of America

Ronald W Ward