Raytheon Company

Flir Systems, Incorporated

Ronald W Berry

William J Hamilton, Jr

Eli E Gordon

Michael S Ray

Paul R Norton

Richard E Bornfreund

Christopher L Fletcher

Richard M Goeden

Robert W Dennis

Method and systems for aligning a first component with a second component are disclosed. For example, a first component may be aligned with a second component during an assembly process, with a first camera used to facilitate the viewing of one or more alignment features of the first component and/or the second component with infrared energy that is transmitted through the first component. A second camera may be used to view at least a portion of the first component and/or at least a portion of the second component using visible light.

Alignment systems and methods

A motorized leveling stage capable of adjusting the angular position of a work piece relative to a reference plane includes an upper stage, a lower stage, and a hinge coupling corresponding edges of the two stages together for relative pivotal movement of the stages. A first spring pivotally biases the upper and lower stages toward each other about the axis of the hinge. A slide is disposed for sliding movement on an upper surface of the lower stage in a direction generally perpendicular to the hinge axis. The slide includes an upper surface defining an inclined plane disposed in sliding abutment with a lower surface of the upper stage such that movement of the slide toward and away from the hinge respectively raises and lowers the upper stage relative to the lower stage. A motorized drive assembly is operable to control movement of the slide relative to the hinge.

Motorized leveling stages

A hybrid microelectronic array structure is fabricated from a readout integrated circuit array of microelectronic integrated circuits and a supported array of supported islands. The supported islands include one or more supported elements, with a respective supported element for each of the readout integrated circuits. The supported array is made by depositing the first semiconductor region onto a supported substrate and depositing the second semiconductor region onto the first semiconductor region, and defining supported islands as electrically isolated segments. On each supported element, a first interconnect is formed to the first semiconductor region and a second interconnect is formed to the second semiconductor region. The supported array is joined to the readout integrated circuit array by an interconnect structure, preferably a bump interconnect structure, to form the hybrid microelectronic array structure, with each readout integrated electrically interconnected to the respective one of the supported elements.

Hybrid microelectronic array structure having electrically isolated supported islands, and its fabrication

An integrated optical device array structure has a plurality of interconnected solid state microelectronic optical device elements associated together on a substrate structure. The optical device elements may be optical detectors or optical emitters. Each optical device element lies on a nonplanar optical array surface. Each optical device element includes an opto-electronic device that interconverts an optical signal and an opto-electronic device electrical signal, and an electrical interface circuit that is in electrical communication with the opto-electronic device electrical signal. The optical device array structure may be fabricated by preparing a flat array of optical device elements and deforming the flat array into the required shape.

Nonplanar integrated optical device array structure and a method for its fabrication

A monolithic microelectronic array structure includes a microelectronic integrated circuit array having a first plurality of microelectronic integrated circuit elements each deposited on a front side of a substrate. The substrates are physically discontinuous so that each substrate comprises a substrate island which is physically separated from the other substrate islands. The monolithic microelectronic array structure optionally includes a first plurality of input/output elements with a respective input/output element associated with and directly connected to each of the microelectronic integrated circuit elements, and a second plurality of electrically conductive interconnects extending between the microelectronic integrated circuit elements of adjacent substrate islands. The monolithic microelectronic array structure may be planar, or it may be curved.

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Goleta, CA, United States of America

Ronald W Berry