Asml Netherlands B.v.

Asml Holding N.v.

Ronald Van Der Wilk

Raymond Wilhelmus Louis Lafarre

Johannes Petrus Martinus Bernardus Vermeulen

Jan-Gerard Cornelis Van Der Toorn

Richard Joseph Bruls

Paul Janssen

Matthew Lipson

Antonius Franciscus Johannes De Groot

Tammo Uitterdijk

Arnoud Willem Notenboom

Louis John Markoya

Kornelis Tijmen Hoekerd

Marc Hauptmann

Jorge Alberto Vieyra Salas

Roger Wilhelmus Antonius Henricus Schmitz

Dylan John David Davies

Alexander Petrus Hilbers

Manon Elise Will

Antonius Hubertus Van Schijndel

Petrus Johannes Van Den Oever

Kenneth C Henderson

Naoko Tsugama

Edwin Johannes Maria Janssen

Santiago E Del Puerto

Yixiang Wang

Yogesh Pramod Karade

Noud Jan Gilissen

Juying Dou

Sebastiaan Maria Johannes Cornelissen

Antonius Johannes Maria Nellissen

Allard Eelco Kooiker

Ying Luo

Satish Achanta

Anko Jozef Cornelus Sijben

Wilhelmus Jacobus Johannes Welters

Qiang Li

Shibing Liu

Ger-Wim J Goorhuis

Tiannan Guan

Han Willem Hendrik Severt

Santiago E Delpuerto

Matteo Filippi

Hendrikus Christoffel Maria Van Doremalen

Shanhui Cao

Kangsheng Qiu

Yinglong Li

Raymond Lafarre

Wilhelmus Welters

Antonius Nellissen

Bas Cornelissen

Anko Sijben

Ger-Wim Jan Goorhuis

A clamp assembly is disclose, the clamp assembly comprising a clamp () configurable to clamp a support member () to a lower base surface () of the clamp by electrostatic adhesion, and an arrangement configurable to direct a gas to the lower base surface () of the clamp. The arrangement is configurable to humidify the gas by exposing the gas to a liquid. Also disclosed is a method of discharging a lower base surface of a clamp, The method comprises the steps of humidifying a gas by exposing the gas to a liquid, and directing the humidified gas to a lower base surface of the clamp.

Clamp assembly

Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

Method, apparatus, and system for wafer grounding

A stage apparatus for a particle-beam apparatus is disclosed. A particle beam apparatus may comprise a conductive object and an object table, the object table being configured to support an object. The object table comprises a table body and a conductive coating, the conductive coating being provided on at least a portion of a surface of the table body. The conductive object is disposed proximate to the conductive coating and the table body is provided with a feature proximate to an edge portion of the conductive coating. Said feature is arranged so as to reduce an electric field strength in the vicinity of the edge portion of the conductive coating when a voltage is applied to both the conductive object and the conductive coating.

Stage apparatus suitable for a particle beam apparatus

A feedthrough for providing an electrical connection is provided. The feedthrough comprises a conductor and a quartz or a glass structure configured to surround at least a portion of the conductor and provide isolation to the conductor. The conductor and the quartz or glass structure may be coaxially arranged. The feedthrough can provide an electrical connection between an inside and outside of a vacuum chamber that contains a sample.

High voltage vacuum feedthrough

A lithographic apparatus is provided. The lithographic apparatus includes a reticle and an electrostatic clamp configured to releasably hold the reticle. The electrostatic clamp includes a first substrate having opposing first and second surfaces, a plurality of burls located on the first surface and configured to contact the reticle, a second substrate having opposing first and second surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.

Lithographic apparatus and method

A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.

Methods and apparatus for obtaining diagnostic information relating to a lithographic manufacturing process

Method and apparatus for obtaining diagnostic information relating to a lithographic manufacturing process, lithographic processing system including diagnostic apparatus

An apparatus for cleaning an object, the apparatus including: an object support for supporting the object; a low pressure chamber for exposing a first surface of the object to a low pressure when the object is arranged on the object support, an electrode arranged adjacent to and separated from the first surface of the object when the object is arranged on the object support, the electrode being in electrical communication with a surface of the object support which is adjacent the first surface of the object; and a power supply arranged to apply a voltage between the electrode and the object; thereby generating a discharge between the object and the electrode.

Apparatus for cleaning an object

A support such as a clamp () is configured to releasably hold a patterning device such as a reticle () to secure it and prevent heat-induced deformation of it. For example, an electrostatic clamp includes a first substrate () having opposing first () and second () surfaces, a plurality of burls () located on the first surface and configured to contact the reticle, a second substrate () having opposing first () and second () surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements () are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.

A method of manufacturing an object holder for use in a lithographic apparatus, the object holder including one or more electrically functional components, the method including: using a composite structure including a carrier sheet different from a main body of the object holder and a layered structure including one or a plurality of layers and formed on the carrier sheet; connecting the composite structure to a surface of the main body such that the layered structure is between the carrier sheet and the surface of the main body; and removing the carrier sheet from the composite structure, leaving the layered structure connected to the main body.

Object holder, lithographic apparatus, device manufacturing method, and method of manufacturing an object holder

A chuck, chuck control system, lithographic apparatus and method of using a chuck are disclosed. In an embodiment, there is provided a chuck () for use in holding a patterning device (MA) or a substrate (W) onto a supporting table (MT, WT) of a lithography apparatus () by electrostatic force, in which the patterning device is for imparting a radiation beam (B) with a pattern in its cross-section to form a patterned radiation beam, and the substrate is for receiving the patterned radiation beam; said chuck comprising: a dielectric member (); a temperature conditioning fluid channel () formed within the chuck; a drive electrode () for applying a potential difference between the drive electrode and the patterning device or substrate across the dielectric member in order to electrostatically attract the patterning device or substrate towards the drive electrode; and a first shield electrode () for reducing or preventing the development of an electric field across temperature conditioning fluid in the temperature conditioning fluid channel due to a voltage applied to the drive electrode, in order to reduce or prevent electrolysis in the fluid.

Chuck, a chuck control system, a lithography apparatus and a method of using a chuck

An electrostatic clamp () configured to hold an object, the electrostatic clamp comprising an electrode (), a resistive portion () formed from a resistive material located on the electrode, and a dielectric portion () formed from a dielectric material located on the resistive portion.

Electrostatic clamp, lithographic apparatus and method

An electrical connector comprises a high voltage pad and a high voltage plate. When connected to another electrical connector, the two plates, which are at the same voltage as the pads, form a region of high voltage in which the field is low. The pads are positioned in that region. An electrostatic clamp of an EUV lithographic apparatus may have such a pad and plate, for connecting to the electrical connector. By placing the interconnection in a low field region, triple points (points of contact between a conductor, a solid insulator and a gas) may be present in that region.

Electrical connector, electrical connection system and lithographic apparatus

Growing community of inventors

Knegsel, Netherlands

Ronald Van Der Wilk