Unisys Corporation

Burroughs, Inc.

Ronald Thomas Gibbs

Grant M Smith

Terry W Louth

Robert E Braun

Keith Mease

Daniel A Jochym

Peter P Klein

Samuel R Romania

Mark W Wessel

A connector assembly is provided having a cable end plug with a body adapted to be connected to a cable with a connector part, and at least one outwardly extending flange on the body. A mating receptacle receives the cable end plug. The receptacle has a body with a complementary connector part to the cable end plug connector part. A retention clip is connected to the receptacle body, and includes at least one spring arm extending outwardly therefrom with a distal entry ramp portion, a retaining shoulder portion and a flange receiving portion. A thickness of the flange is approximately equal to a depth of the flange receiving portion so that the retaining shoulder portion engages behind the flange in a connected position of the cable end plug in the mating receptacle. For release, the retaining shoulder can be set at an angle of at least 94&#xb0; to the flange receiving portion to form a release ramp that allows disengagement when a sufficiently high predetermined release force is applied to the cable end plug. Alternatively, the retaining shoulder is set at about 90&#xb0; and ejector tabs are provided on the cable end plug to disengage the spring arms.

Cable end retention clip

An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.

Method and apparatus for EMI shielding

A structure for removing heat from a packaged electronic component. The structure includes three, main elements. First, a heat sink has a pedestal with opposing ends and a plurality of fins separated by spaces and disposed on the pedestal. The heat sink dissipates heat generated by the packaged electronic component. Second, parallel rails are disposed adjacent the opposing ends of the pedestal, each rail having a catch. Third, a spring clip has (a) end hooks which engage the catches to retain the spring clip on the rails, and (b) a strut extending between the hooks, fitting into the space between adjacent fins, and including an apex which contacts substantially centrally the pedestal and applies a force pressing the heat sink toward the packaged electronic component. Thus, the heat sink is removably attached at least indirectly to the packaged electronic component. Also disclosed is a method of using the structure.

Retention of heat sinks on electronic packages

An individual integrated circuit package utilizing an intermediate die carrier having legs in contact with a wiring substrate and a compatible lid to effect hermeticity. More specifically, the carrier includes on its outer surface a raised section and a peripheral ledge. The cap is formed with a cutout in its closed extremity to accommodate the raised carrier section and the portions of the cap adjacent the cutout rest upon and are sealed to the carrier ledge. The rim of the cap at its open extremity contacts and is sealed to the substrate to form the completed hermetic package.

Hermetic single chip integrated circuit package

An hermetic integrated circuit package having a single die wherein wire connections to area pads on the active face of the die are carried through an hermetic boundary comprised of a cover plate to an external interface with the next succeeding interconnect level. The package is comprised of a heat exchange element to which the die is attached, a cover plate having holes homologously positioned with respect to the area pads on the die and a seal ring for joining the heat exchange element to the cover plate. The wire connections which are carried through the holes and sealed to the cover plate are externally accessible.

Micro individual integrated circuit package

The present disclosure describes an air cooling system which has the ability to maintain acceptable temperature levels in present day high density electronic equipment. More specifically, the system provides an arrangement whereby each printed circuit card has its own ducting structure affixed thereto to form an integral unit. Cooling air streams are directed simultaneously from individual apertures in the ducting structure upon a respective plurality of integrated circuit package assemblies mounted on the card.

Growing community of inventors

Paoli, PA, United States of America

Ronald Thomas Gibbs