Avago Technologies Fiber IP (singapore) Pte. Ltd

Glo Ab

Hewlett-packard Company

Agilent Technologies, Inc.

Other

Avago Technologies General IP (singapore) Pte. Ltd.

Ronald T Kaneshiro

Douglas Harvey

Ye Chen

Chung-Yi Su

Tak Kai Wang

Ping Wang

Craig T Cummings

Tyler Kakuda

David J K Meadowcroft

Bing Shao

James L Chang

Stefano G Therisod

Martin F Schubert

Storrs Townsend Hoen

Nathan Fredrick Gardner

Robert E Wilson

Seng-Kum Chan

Fariba Danesh

Daniel Bryce Thompson

Christopher L Coleman

Frederick W Miller

Brenton Arthur Baugh

Xiaozhong Wang

Paul Yu

James Joseph Dudley

Samir Aboulhouda

Farid Matta

James M Williams

Kit M Cham

Myunghee Lee

Kenneth H Hahn

Kit Cham

An-Nien Cheng

Tun Sein Tan

Yu-Chun Chang

Joseph Straznicky

Eng-Ho Soo

Heng Seng Alvin Low

David George Cunningham

Ban-Poh Loh

Pradeep Raj Komar

Matthew Heydinger

Y Man Teng

A pixelated display device and a method for making the same are disclosed. The device may include an array of nanowire LEDs located above a substrate. When the nanowire LEDs are initially grown, they may emit first-wavelength light proximally to the substrate and second-wavelength light distally from the substrate. The nanowires may remain as initially grown, in which case only second-wavelength light is visible, or the second-wavelength light emitting portions may be etched away such that only first-wavelength light is visible.

Pixilated display device based upon nanowire LEDs and method for making the same

A light emitting device includes a support having an interstice and at least one LED located in the interstice and at least one of a waveguide or an optical launch having a transparent material encapsulating the at least one LED located in the interstice.

Integrated back light unit

An optical display system includes a polarizer, an integrated back light unit optically connected to a first face of the polarizer and a display comprising an array of pixels optically connected to a second face of the polarizer. The first face of the polarizer and the second face of the polarizer are not parallel and the polarizer is configured to direct light from the integrated back light unit to the display.

Optical display system

Packaged light emitting diodes (LEDs) and methods of packaging a LED include providing a first lead having a first recess in a bottom surface and a second lead having a second recess in a bottom surface, placing a LED die over a top surface of at least one of the first and the second leads, electrically connecting the LED die to the first lead and to the second lead, forming a package around the LED die that includes an opening in its upper surface exposing at least the LED die, and separating the package containing the LED die, the first lead and the second lead from a lead frame such that the package contains a first castellation and a second castellation in a side surface of the package, such that the castellations expose the leads and/or a first platable metal which is electrically connected to the leads.

Molded LED package and method of making same

Packaged LED devices include a first lead having a first recess in a bottom surface, a second lead having a second recess in a bottom surface, a LED die located over a top surface of at least one of the leads and electrically connected to the leads, and a package located around the LED die, the first lead and the second lead. The package contains an opening in its upper surface exposing at least the LED die. The package also contains a first castellation and a second castellation in a side surface of the package, such that the first castellation exposes at least one of the first lead and a first platable metal which is electrically connected to the first lead, and the second castellation exposes at least one of the second lead and a second platable metal which is electrically connected to the second lead.

Packaged LED device with castellations

Methods of packaging a light emitting diode (LED) include providing a first lead having a first recess in a bottom surface and a second lead having a second recess in a bottom surface, placing a LED die over a top surface of at least one of the first and the second leads, electrically connecting the LED die to the first lead and to the second lead, forming a package around the LED die that includes an opening in its upper surface exposing at least the LED die, and separating the package containing the LED die, the first lead and the second lead from a lead frame such that the package contains a first castellation and a second castellation in a side surface of the package, such that the castellations expose the leads and/or a first platable metal which is electrically connected to the leads.

Method of making molded LED package

In a connector system, a first connector is mechanically and optically mateable with a second connector to form one or more optical signal communication links. A wiping cleaner is included on at least one of the first and second connectors for cleaning an optical port of the other of the first and second connectors when the connectors are plugged together. The first and second connectors can further be electrically mateable to provide both optical and electrical signal communication links.

Connector system having electrical and optical links with optical link cleaner

Alignment of one or more lenses with one or more opto-electronic devices in an opto-electronic system is aided by an aligner device having a substantially cylindrical body with a base and an outer ring. The base has one or more openings, one of which is a first opto-electronic device opening. The first opto-electronic device opening has a substantially circular shape coaxial with the outer ring and coaxial with a central axis of the aligner device.

Opto-electronic alignment system and method

A consumer input/output (CIO) optical transceiver module, an active optical cable that incorporates a CIO optical transceiver module, and a method for using a CIO optical transceiver module in an active optical cable are provided. In contrast to optical transceiver modules currently used in active optical cables, which utilize parallel arrays of laser diodes and parallel arrays of photodiodes, the CIO optical transceiver module includes two singlet laser diodes and two singlet photodiodes for providing two high-speed transmit channels and two high-speed receive channels, respectively. Because the singlet laser diodes and photodiodes of the CIO optical transceiver module are less costly than the parallel arrays of laser diodes and parallel arrays of photodiodes that are used in known active optical cables, the CIO optical transceiver module can be manufactured at relatively low costs with high quality, and therefore is well suited for consumer applications.

Consumer input/output (CIO) optical transceiver module for use in an active optical cable, an active optical cable that incorporates the CIO optical transceiver module, and a method

A parallel optical communications device is provided that has a mounting core that functions as a mounting system for mounting core components of the parallel optical communications device. In addition, the mounting core functions as a heat dissipation system for the core components of the parallel optical communications device, and also protects the core components and other elements of the communications device from dust and damage that can be caused by handling and other factors. In addition to performing the aforementioned functions, the mounting core is configured to enable the parallel optical communications device to be made extremely small in size while also protecting signal integrity.

Optical communications device having a mounting core and method

The invention is directed to an OSA having a TO-can-type configuration that is relatively low-cost to manufacture and that has functionality for monitoring and controlling the temperature of the laser diode without the need for additional pins or an increase in the size of the OSA. Thus, the OSA typically includes four or five pins at most. These features of the invention are achieved by providing a thermal control circuit, a temperature sensor and a heater that are integrated along with a laser output power monitor photodiode into the submount assembly substrate.

Small form factor transmitter optical subassembly (TOSA) having functionality for controlling the temperature, and methods of making and using the TOSA

A fiber optic link is provided that uses a relatively low-cost transceiver that incorporates relatively inexpensive low bandwidth optical and electrical components to achieve high data rate operations. The data rate of the fiber optic link can be greater than the data rate of the laser of the transceiver provided the laser meets certain noise requirements; in particular, the relative intensity noise (RIN) of the laser must be low enough to ensure low bit error rate (BER) operation of the link.

Fiber optic link, a transceiver for use in the link, and methods for designing and constructing fiber optic links and transceivers

An optical module includes an active optical component, an optical fiber, a beam shaping optical component and a positioning device. The optical fiber is arranged with respect to the active optical component to be capable of propagating light along an optical path between the active optical component and the optical fiber. The beam shaping optical component is located in the optical path between the optical fiber and the active optical component. The positioning device is for moving either the beam shaping optical component with respect to the optical fiber, the beam shaping optical component with respect to the active optical component, or the active optical component with respect to the optical fiber, or a combination.

Optical module aligned after assembly

Growing community of inventors

San Jose, CA, United States of America

Ronald T Kaneshiro