Texas Instruments Corporation

Ronald S Croff

Lawrence D Dyer

Michael A Mignardi

Robert G McKenna

Laurinda W Ng

A method of separating wafers, such as those used for semiconductor device manufacture, into die. A partly fabricated wafer is covered with a protective coating over its top surface (10). The wafer is then inscribed to define separation lines between die, with the separation lines being of a predetermined depth (12). The protective coating is then removed (14), and at least one processing step is performed at the wafer level (15, 22-24), before the inscribed wafer is separated into die. Then, the wafer is separated into die along the separation lines (17).

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Allen, TX, United States of America

Ronald S Croff