Eastman-kodak Company

X-celeprint Limited

X Display Company Technology Limited

Global Oled Technology LLC

Intellectual Ventures Fund 83 LLC

Kodak Alaris Inc.

Other

Apple Inc.

Semprius, Inc.

Display Company Technology Limited

X-fab Semiconductor Foundries Ag

Monument Peak Ventures, LLC

Mounument Peak Ventures, LLC

Ronald S Cok

Christopher Andrew Bower

Matthew Alexander Meitl

Michael E Miller

Robert R Rotzoll

Brook David Raymond

António José Marques Trindade

Andrew Daniel Arnold

Mitchell Stewart Burberry

John W Hamer

Erich Radauscher

Salvatore Bonafede

Carl Prevatte

Raja Fazan Gul

John N Border

John Randall Fredlund

David Julian Gomez

Paul James Kane

Carl Ray Prevatte, Jr

Joseph Anthony Manico

Yongcai Wang

John Andrew Lebens

Christopher J White

Dustin Lee Winters

Donald R Preuss

Michael J Murdoch

Yuan-Sheng Tyan

Elena A Fedorovskaya

Robert P Bourdelais

Andrew Frederick Kurtz

Michael L Boroson

Todd Mathew Spath

Joel D Shore

David P Trauernicht

Terrence Robert O'Toole

Peter O Stubler

Kurt DeLance Sieber

Roger Stanley Kerr

David D Kessler

Lee William Tutt

Roger Guy Markham

Kam Chuen Ng

Amy D Enge

Joseph Carr

Paula J Alessi

Charles Chester Anderson

Steven Evans

Debasis Majumdar

Thomas Nathaniel Tombs

Mary Christine Brick

Donald R Diehl

John P Spoonhower

Margaret Jones Helber

Glen C Irvin, Jr

Imre Knausz

Thomas Joseph Murray

James Edward Sutton

Cheryl J Kaminsky

Sen Wang

Kenneth James Lushington

Timothy John Tredwell

Willem Den Boer

Hwei-Ling Yau

Etienne Menard

Kurt Michael Sanger

Nelson Adrian Blish

Christopher B Rider

Jin-Shan Wang

Alan Richard Priebe

Steven A Van Slyke

Thomas D Pawlik

James R Milch

Joseph F Revelli, Jr

David J Williams

Paul P Lee

Andrea S Rivers

Judith A Bose

Alin Mihai Fecioru

Mark P Hinman

Ken G Purchase

David Lynn Patton

Gary Alan Kneezel

Michael Edgar Long

Ching W Tang

Joseph R Bietry

John A Agostinelli

John R Fyson

Shelby Forrester Nelson

Keith B Kahen

Krishnan Chari

Jeremy M Grace

Robert C Bryant

Mark E Bridges

Chris W Honsinger

Joseph E Yokajty

Julian Charles Carter

Edward Covannon

Dennis R Freeman

Thomas E Madden

Christopher R Morton

A stamp for micro-transfer printing includes a support having a support surface and posts disposed on the support surface. Each post has a distal end extending away from the support. The post has a post surface on the distal end. The post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface and can be operable to form multiple delamination fronts when a first side of a micro-device is in contact with the post surface, a second side of the micro-device is in contact with a target surface of a target substrate, and the support is moved in a horizontal direction parallel to the target substrate surface. The post surface or ridges can be rectangular or non-rectangular with opposing edges having different lengths.

Transfer printing stamps and methods of stamp delamination

A hybrid document includes a flexible document having visible markings. One or more light-controlling elements and a controller are embedded in or on the flexible document. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. In some embodiments, the controller includes a memory and a value can be stored in the memory and displayed by the light-controlling element(s). In some embodiments, the value can be assigned or varied by a hybrid currency teller machine.

Piezoelectric power components

A flexible electronic structure includes a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer and a component. The component can include a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side, a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact, and a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact. The component can be disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.

Flexible electronic structures

A passive-matrix controller provides a control signal to each column of multiple columns of components, a driver for each column wire, and a multiplexer. Each column of components is connected to a column wire. The driver provides a drive signal in response to the control signal and the multiplexer comprises an output connected to each column wire and an input connected to each driver and connects the inputs to the outputs in response to a multiplex signal from the passive-matrix controller. The components can be inorganic micro-light-emitting diodes.

Multiplexed column drivers for passive-matrix control

A stamp for micro-transfer printing includes a support having a support surface and posts disposed on the support surface. Each post has a proximal end in contact with the support and a distal end extending away from the support. The post has a post surface on the distal end. The post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface and can be operable to form multiple delamination fronts when a first side of a micro-device is in contact with the post surface, a second side of the micro-device is in contact with a target surface of a target substrate, and the support is moved in a horizontal direction parallel to the target substrate surface. The post surface or ridges can be rectangular or non-rectangular with opposing edges having different lengths.

A system with dimming control includes a luminance signal, a variable-frequency-clock signal generator responsive to the luminance signal operable to generate a variable-frequency clock signal, a pixel-control signal generator responsive to the variable-frequency clock signal operable to generate a pixel-control signal, and a pixel including a light emitter responsive to the pixel-control signal. The pixel-control signal can be a temporally modulated signal such as a pulse-width modulation signal or a pulse-density modulation signal. A display can comprise an array of pixels and a display controller. The pixel or the display controller can include the variable-frequency clock signal or the pixel-control signal generator, or both.

Display dimming for pulse-width-modulation pixel control

A stacked electronic component comprises a stack of three or more print layers. Each print layer has an area less than any print layers beneath the print layer in the stack. Each print layer comprises a dielectric layer and a functional layer disposed on the dielectric layer. The functional layer comprises an exposed conductive portion that is not covered with a dielectric layer of any of the print layers and each exposed conductive portion is nonoverlapping with any other exposed conductive portion. A patterned electrode layer is coated on at least a portion of the stack and defines one or more electrodes. Each electrode of the one or more electrodes in electrical contact with an exclusive subset of the exposed conductive portions. The functional layers can be passive conductors forming capacitors, resistors, inductors, or antennas, or active layers forming electronic circuits.

Method of making a stacked electronic component

An electromagnetic communication device includes a device substrate, an antenna formed on or in the device substrate, and a circuit element having an electrical circuit and one or more electrically conductive connection posts protruding from the circuit element. Each of the connection posts is electrically connected to the electrical circuit and at least one connection post is electrically connected to the antenna.

Antenna with micro-transfer-printed circuit element

A pixel with a color-agnostic repair site includes a pixel controller, a first site for a first light emitter electrically connected to the pixel controller with a first wire, a second site for a second light emitter electrically connected to the pixel controller with a second wire different from the first wire, and a repair site for a repair light emitter. A repair wire can independently electrically connect the repair site to the pixel controller. A repair wire can electrically connect the repair site to the first wire or to the second wire with a jumper. The repair site can electrically connect to the first wire or to the second wire. A first repair wire can electrically connect the repair site to the first wire, a second repair wire can electrically connect the repair site to the second wire, and one of these wires can be cut.

Color-agnostic pixel repair sites

A dynamic-voltage-control pixel includes a pixel memory, an input circuit operable at a refresh voltage to receive pixel data and store the received pixel data in the pixel memory, a light emitter, and an output circuit operable at a drive voltage to read the stored pixel data from the pixel memory and control the light emitter to output light according to the read stored pixel data. The drive voltage can be less than the refresh voltage. The input circuit, pixel memory, and output circuit can be connected to a common-voltage wire providing a common voltage for operating each of the input circuit, pixel memory, and output circuit.

Dynamic-voltage control for displays

An interpolated flat-panel display comprises a display substrate and an array of clusters disposed on the display substrate. Each cluster comprises an exclusive group of display pixels and a cluster controller for controlling the display pixels. The cluster controller is operable to receive input data specifying a desired light output from one or more but fewer than all of the display pixels in the group of display pixels, calculate interpolated data at least in part from the input data, and drive the display pixels to emit light in response to the calculated interpolated data and received input data. The input data can correspond to an image pixel in an input image. The cluster controller can be operable to receive a parameter value describing attributes of a local portion of the input image including the image pixel and the interpolated data is calculated at least in part from the parameter value.

Displays with distributed pixel interpolation

An interpolated flat-panel display comprises a display substrate, pixel controllers disposed in a controller array over the display substrate, and pixels disposed in a pixel array over the display substrate. Each pixel controller is connected to one or more control lines and is operable to output pixel information. Each pixel is operable to emit light in response to pixel information received from a pixel controller. The pixel array is larger than the controller array, each pixel is connected to at least one pixel controller, and at least some pixels are interpolated pixels connected to at least two pixel controllers and are operable to emit light in response to pixel information received from the at least two pixel controllers.

Displays with interpolated pixels

A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.

Rigid micro-modules with iLED and light conductor

A multi-component transistor structure includes components each comprising an individual, discrete, and separate component substrate and a component transistor. The component transistor includes a transistor element having a transistor element resistance. A component connection is disposed external to the transistor element and has a connection resistance. The component connection electrically connects the transistor elements in the components in parallel. The connection resistance is less than the transistor element resistance of at least one corresponding transistor element, less than an average of the transistor element resistances of all of the corresponding transistor elements, or less than the sum of all of the transistor element resistances of all of the corresponding transistor elements. The component transistors are functionally similar and at least one of the components is disposed on another different one of the components in a component stack.

Disaggregated transistor devices

A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.

Printed components in device pockets

Growing community of inventors

Rochester, NY, United States of America

Ronald S Cok