Eastman-kodak Company

X-celeprint Limited

X Display Company Technology Limited

Global Oled Technology LLC

Intellectual Ventures Fund 83 LLC

Kodak Alaris Inc.

Other

Apple Inc.

Semprius, Inc.

Display Company Technology Limited

Leonhard Kurz Stiftung & Co Kg

X-fab Semiconductor Foundries Ag

Monument Peak Ventures, LLC

Mounument Peak Ventures, LLC

Ronald S Cok

Christopher Andrew Bower

Matthew Alexander Meitl

Michael E Miller

Robert R Rotzoll

Brook David Raymond

António José Marques Trindade

Andrew Daniel Arnold

Mitchell Stewart Burberry

John W Hamer

Salvatore Bonafede

Erich Radauscher

Carl Prevatte

Raja Fazan Gul

John N Border

John Randall Fredlund

David Julian Gomez

Paul James Kane

Carl Ray Prevatte, Jr

Joseph Anthony Manico

Yongcai Wang

John Andrew Lebens

Christopher J White

Dustin Lee Winters

Donald R Preuss

Michael J Murdoch

Yuan-Sheng Tyan

Elena A Fedorovskaya

Robert P Bourdelais

Andrew Frederick Kurtz

Michael L Boroson

Todd Mathew Spath

Joel D Shore

David P Trauernicht

Terrence Robert O'Toole

Peter O Stubler

Kurt DeLance Sieber

Roger Stanley Kerr

David D Kessler

Lee William Tutt

Roger Guy Markham

Kam Chuen Ng

Amy D Enge

Joseph Carr

Paula J Alessi

Charles Chester Anderson

Steven Evans

Debasis Majumdar

Thomas Nathaniel Tombs

Mary Christine Brick

Donald R Diehl

John P Spoonhower

Margaret Jones Helber

Glen C Irvin, Jr

Imre Knausz

Thomas Joseph Murray

James Edward Sutton

Cheryl J Kaminsky

Sen Wang

Kenneth James Lushington

Timothy John Tredwell

Willem Den Boer

Hwei-Ling Yau

Etienne Menard

Kurt Michael Sanger

Nelson Adrian Blish

Christopher B Rider

Jin-Shan Wang

Alan Richard Priebe

Steven A Van Slyke

Thomas D Pawlik

James R Milch

Joseph F Revelli, Jr

David J Williams

Paul P Lee

Andrea S Rivers

Judith A Bose

Alin Mihai Fecioru

Mark P Hinman

Ken G Purchase

David Lynn Patton

Gary Alan Kneezel

Michael Edgar Long

Ching W Tang

Joseph R Bietry

John A Agostinelli

John R Fyson

Shelby Forrester Nelson

Keith B Kahen

Krishnan Chari

Jeremy M Grace

Robert C Bryant

Chris W Honsinger

Mark E Bridges

Joseph E Yokajty

Julian Charles Carter

Edward Covannon

Dennis R Freeman

Thomas E Madden

Christopher R Morton

A printed structure includes a substrate comprising a substrate surface, a substrate circuit disposed in or on in a circuit area of the substrate surface, a substrate post protruding from the substrate surface exterior to the circuit area, and a component having a component top side and a component bottom side opposite the component top side. The component bottom side can be disposed on the substrate post and adhered to the substrate surface forming an air gap between the component bottom side and the substrate circuit. The substrate post can comprise a substrate post material that is a cured adhesive. Some embodiments comprise a substrate electrode and the component comprises an electrically conductive connection post extending from the component bottom side toward the substrate in electrical contact with the substrate electrode.

Printing components to substrate posts with gaps

A multi-LED structure comprises a first LED and a separate second LED disposed on a common multi-LED native substrate. The LEDs each comprise a common first layer having a cantilever portion and a base portion and a common second layer having a light-emitting emission portion disposed only over the base portion. An LED electrode electrically connects the first LED to the second LED. The cantilever portion extends in a direction different from the base portion or a length of the cantilever portion is less than a distance between the emission portions of the first and second LEDs.

Multi-LED structures with single current and voltage supplies

An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.

Modules with integrated circuits and devices

A variable-stiffness module includes a rigid structure having a first stiffness, an intermediate substrate having a second stiffness less than the first stiffness, and a flexible substrate having a third stiffness less than the second stiffness. The rigid structure is disposed on the intermediate substrate and the intermediate substrate is disposed on the flexible substrate. A conductor is disposed partially on the intermediate substrate and partially on the flexible substrate and is connected to the rigid structure. The conductor extends from the rigid structure to the intermediate substrate to the flexible substrate. In some embodiments, a variable-stiffness module includes any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor can be an optical conductor or an electrical conductor and can be disposed over the rigid structure or between the rigid structure and the intermediate substrate.

Variable stiffness modules

A hybrid document includes a flexible document having visible markings. One or more light-controlling elements and a controller are embedded in or on the flexible document. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. In some embodiments, the controller includes a memory and a value can be stored in the memory and displayed by the light-controlling element(s). In some embodiments, the value can be assigned or varied by a hybrid currency teller machine.

Hybrid documents with electronic indicia

A stamp includes a rigid support and an array of posts disposed in combination with the rigid support. Each of the posts in the array of posts extends in a direction away from the rigid support. The distal end of each of the posts in the array of posts has a structured three-dimensional surface including a first micro-post that extends a first distance away from the rigid support and a second micro-post that extends a second distance away from the rigid support. The second distance is less than the first distance.

Stamps with structured microposts

A stamp for micro-transfer printing includes a support having a support surface and posts disposed on the support surface. Each post has a distal end extending away from the support. The post has a post surface on the distal end. The post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface and can be operable to form multiple delamination fronts when a first side of a micro-device is in contact with the post surface, a second side of the micro-device is in contact with a target surface of a target substrate, and the support is moved in a horizontal direction parallel to the target substrate surface. The post surface or ridges can be rectangular or non-rectangular with opposing edges having different lengths.

Transfer printing stamps and methods of stamp delamination

Piezoelectric power components

A flexible electronic structure includes a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer and a component. The component can include a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side, a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact, and a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact. The component can be disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.

Flexible electronic structures

A passive-matrix controller provides a control signal to each column of multiple columns of components, a driver for each column wire, and a multiplexer. Each column of components is connected to a column wire. The driver provides a drive signal in response to the control signal and the multiplexer comprises an output connected to each column wire and an input connected to each driver and connects the inputs to the outputs in response to a multiplex signal from the passive-matrix controller. The components can be inorganic micro-light-emitting diodes.

Multiplexed column drivers for passive-matrix control

A stamp for micro-transfer printing includes a support having a support surface and posts disposed on the support surface. Each post has a proximal end in contact with the support and a distal end extending away from the support. The post has a post surface on the distal end. The post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface and can be operable to form multiple delamination fronts when a first side of a micro-device is in contact with the post surface, a second side of the micro-device is in contact with a target surface of a target substrate, and the support is moved in a horizontal direction parallel to the target substrate surface. The post surface or ridges can be rectangular or non-rectangular with opposing edges having different lengths.

A system with dimming control includes a luminance signal, a variable-frequency-clock signal generator responsive to the luminance signal operable to generate a variable-frequency clock signal, a pixel-control signal generator responsive to the variable-frequency clock signal operable to generate a pixel-control signal, and a pixel including a light emitter responsive to the pixel-control signal. The pixel-control signal can be a temporally modulated signal such as a pulse-width modulation signal or a pulse-density modulation signal. A display can comprise an array of pixels and a display controller. The pixel or the display controller can include the variable-frequency clock signal or the pixel-control signal generator, or both.

Display dimming for pulse-width-modulation pixel control

A stacked electronic component comprises a stack of three or more print layers. Each print layer has an area less than any print layers beneath the print layer in the stack. Each print layer comprises a dielectric layer and a functional layer disposed on the dielectric layer. The functional layer comprises an exposed conductive portion that is not covered with a dielectric layer of any of the print layers and each exposed conductive portion is nonoverlapping with any other exposed conductive portion. A patterned electrode layer is coated on at least a portion of the stack and defines one or more electrodes. Each electrode of the one or more electrodes in electrical contact with an exclusive subset of the exposed conductive portions. The functional layers can be passive conductors forming capacitors, resistors, inductors, or antennas, or active layers forming electronic circuits.

Method of making a stacked electronic component

An electromagnetic communication device includes a device substrate, an antenna formed on or in the device substrate, and a circuit element having an electrical circuit and one or more electrically conductive connection posts protruding from the circuit element. Each of the connection posts is electrically connected to the electrical circuit and at least one connection post is electrically connected to the antenna.

Antenna with micro-transfer-printed circuit element

A pixel with a color-agnostic repair site includes a pixel controller, a first site for a first light emitter electrically connected to the pixel controller with a first wire, a second site for a second light emitter electrically connected to the pixel controller with a second wire different from the first wire, and a repair site for a repair light emitter. A repair wire can independently electrically connect the repair site to the pixel controller. A repair wire can electrically connect the repair site to the first wire or to the second wire with a jumper. The repair site can electrically connect to the first wire or to the second wire. A first repair wire can electrically connect the repair site to the first wire, a second repair wire can electrically connect the repair site to the second wire, and one of these wires can be cut.

Color-agnostic pixel repair sites

Growing community of inventors

Rochester, NY, United States of America

Ronald S Cok