Honeywell International Inc.

Ronald R Katsanes

Desaraju Varaprasad

Wei T Huang

Joseph T Kennedy

Songyuan Xie

A composition is provided including a resin including one or more silicon-based materials, one or more organic-based materials, or a combination of silicon-based materials and organic-based materials. The composition further includes a first solvent having a boiling point from 140&#xb0; C. to 250&#xb0; C. and a second solvent having a boiling point from 50&#xb0; C. to 110&#xb0; C., wherein the a weight ratio of the first solvent to the second solvent is from 1:1 to 1:5. Methods for applying coatings to substrates are also provided.

Materials and spin coating methods suitable for advanced planarization applications

A method for temporarily protecting a semiconductor device wafer during processing includes preparing a solution including poly(vinyl alcohol) and water, coating the device wafer with the prepared solution, baking the coated device wafer to form a protective layer, processing the baked device wafer, and dissolving the protective layer from the processed wafer with a solvent at a temperature not less than 65&#xb0; C. The solvent includes water. The baking is at a temperature from 150&#xb0; C. to 170&#xb0; C. The protective layer remains on the baked device wafer during processing. The poly(vinyl alcohol) has a degree of hydrolysis greater than or equal to 93%.

Removable temporary protective layers for use in semiconductor manufacturing

A planarization composition is disclosed herein that comprises: a) a structural constituent; and b) a solvent system, wherein the solvent system is compatible with the structural constituent and lowers the lowers at least one of the intermolecular forces or surface forces components of the planarization composition. A film that includes this planarization composition is also disclosed. In addition, another planarization composition is disclosed herein that comprises: a) a cresol-based polymer compound; and b) a solvent system comprising at least one alcohol and at least one ether acetate-based solvent. A film that includes this planarization composition is also disclosed. A layered component is also disclosed herein that comprises: a) a substrate having a surface topography; and b) a planarization composition or a film such as those described herein, wherein the composition is coupled to the substrate. Methods of forming a planarization compositions are also disclosed herein that comprise: a) providing a structural constituent; b) providing a solvent system, wherein the solvent system is compatible with the structural constituent and lowers at least one of the intermolecular forces or surface forces components of the planarization composition; and c) blending the structural constituent and the solvent system to form a planarization composition. Methods of forming a film are also disclosed that comprise: a) providing a planarization composition such as those disclosed herein; and b) evaporating at least part of the solvent system to form a film.

Growing community of inventors

Newark, CA, United States of America

Ronald R Katsanes