Motorola Corporation

Ronald Peter Kochanski

Detlef W Schmidt

A surface mountable component (110) is urged toward a substrate (102) during a bonding operation. The apparatus consists of a thermally activated clamping device (TACD) (300) having alloys with differing relative deflection-temperature characteristics. When exposed to elevated temperatures, the thermally activated clamping device (300) deforms a predetermined amount depending upon the heat-energy applied to the thermally activated clamping device (300). This allows for a mounting bracket that applies a force on a component (110) in proportion to an amount of heat-energy applied to the mounting bracket. In addition, the thermally activated clamping device (300) is coupled locally to the substrate in an area surrounding the component which eliminates the need for long, fragile mounting brackets. The method consists of utilizing the relative deflection-temperature characteristics of metals to clamp a component (110) during a bonding operation.

Thermally activated clamping apparatus and component part and method of

A threaded fastener that includes a drive head having a recessed region and a threaded shaft that is mechanically and radially attached to the drive head is improved to comprise a drive portion. The drive portion is mechanically attached to the opposite end of the threaded shaft as a drive head and has a geometric shape that is a mating image of the recessed portion of the drive head and is on the same axis as the drive head. With such a configuration, the drive portion of one threaded fastener can be mechanically coupled to the recessed region of another threaded fastener in a stacked fashion such that one threaded fastener is used to drive another threaded fastener into a threaded receptacle.

Threaded fastener

A semiconductor device having a plurality of conductive leads extending therefrom is provided for reliably and repeatable positioning and holding a separate electronic device. The conductive leads are disposed apart to provide a predetermined space therebetween. Upstanding sidewall portions of desired dimensions are formed in the conductive leads at a predetermined distance from the central body portion of the semiconductor device. The separate electronic device is inserted in the space between opposite upstanding sidewall portions and is engaged and mechanically held thereby.

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Arlington Heights, IL, United States of America

Ronald Peter Kochanski