Dow Corning Corporation

Ronald Paul Boisvert

Duane R Bujalski

Kai Su

Brian Harkness

Zhongtao Li

Dimitris Katsoulis

Russell Keith King

Bianxiao Zhong

Craig Rollin Yeakle

Gary Thomas Burns

Katsuya Eguchi

Timothy Chi-Shan Chao

Duan Li Ou

Pierre Maurice Chevalier

John Albaugh

Satyendra Kumar Sarmah

David Ha

Stelian Grigoras

A silicone resin containing boron, aluminum, and/or titanium, and having silicon-bonded branched alkoxy groups; a silicone composition containing a silicone resin; and a method of preparing a coated substrate comprising applying a silicone composition on a substrate to form a film and pyrolyzing the silicone resin of the film.

Silicone resin and silicone composition

Silicone resins comprising 5 to 50 mole % of (PhSiO(OH)) units and 50 to 95 mole % (HSiO(OH)), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.

Etch-stop resins

This invention pertains to a siloxane resin composition comprising RSiOsiloxane units, RSiOsiloxane units and (RO)SiOsiloxane units wherein Ris an alkyl group having 1 to 5 carbons, hydrogen, or mixtures thereof; Ris a monovalent organic group having 6 to 30 carbons; Ris a branched alkyl group having 3 to 30 carbons, b is from 1 to 3; and the siloxane resin contains from 2.5 to 85 mole percent RSiOunits, 2.5 to 50 mole percent RSiOunits and 5 to 95 mole percent (RO)SiOunits. The siloxane resin is useful to make insoluble porous resin and insoluble porous coatings. Heating a substrate coated with the siloxane resin at a sufficient temperature effects removal of the Rand RO groups to form an insoluble insoluble porous coating having a porosity of 1 to 60 volume percent and a dielectric constant in the range of 1.5 to 3.0.

Siloxane resins

Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO ) (R&prime;SiO ) , wherein R is selected from the group consisting of C -C alkyl, C -C alkenyl, C -C alkoxy, C -C alkenoxy, and C -C substituted hydrocarbon; R&prime; is selected from the group consisting of &mdash;H, C -C unsubstituted hydrocarbon, and C -C substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x&plus;y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO . Also disclosed herein is a method of preparing such a resin solution, as well as a method of preparing a solid coating, comprising (i) coating the resin solution on a surface; (ii) removing the solvent from the resin solution; (iii) removing R groups from the organosiloxane resin; and (iv) curing the resin solution, to form the solid coating. Coatings prepared from the resins disclosed herein have relatively low dielectric constants and also have relatively low SiH content and relatively high modulus.

Hydrosilsesquioxane resin compositions having improved thin film properties

This invention pertains to a siloxane resin composition comprising R SiO siloxane units, R SiO siloxane units and (R O) SiO siloxane units wherein R is an alkyl group having 1 to 5 carbons, hydrogen, or mixtures thereof; R is a monovalent organic group having 6 to 30 carbons; R is a branched alkyl group having 3 to 30 carbons, b is from 1 to 3; and the siloxane resin contains from 2.5 to 85 mole percent R SiO units, 2.5 to 50 mole percent R SiO units and 5 to 95 mole percent (R O) SiO units. The siloxane resin is useful to make insoluble porous resin and insoluble porous coatings. Heating a substrate coated with the siloxane resin at a sufficient temperature effects removal of the R and R O groups to form an insoluble insoluble porous coating having a porosity of 1 to 60 volume percent and a dielectric constant in the range of 1.5 to 3.0.

A polymer matrix composite comprises a matrix of a cured methylsilsesquioxane resin and a reinforcing material. The composite has low heat release rate, smoke yield, and carbon monoxide yield when burned. After burning, the composite has high char yield and retains much of its initial tensile strength. The method for making the composite comprises applying a silanol-functional methylsilsesquioxane resin comprising 70 to 90 mol % ((CH.sub.3)SiO.sub.3/2) units and 10 to 25 mol % (CH.sub.3 Si(OH)0.sub.2/2) units to a reinforcing material and curing the resin.

Silicone resin composites for fire resistance applications and method

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Midland, MI, United States of America

Ronald Paul Boisvert