Intel Corporation

Ronald L Spreitzer

Robert M Nickerson

Brian Taggart

John C Conner

Boping Xie

Israel Petronius

Kenneth Brown

Sanjeev Gupta

Jonathan Doylend

Daniel Grodensky

Eleanor Patricia Paras Rabadam

Sushrutha Gujjula

Ron Friedman

Stephen Keele

Nan Kong Ng

Sam Khalili

Gal Dvoretzki

Qifeng Wu

Guiyun Bai

Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Silicon photonic systems for LIDAR applications

In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

Integrated circuit device mounting with folded substrate and interposer

Folded substrate with interposer package for integrated circuit devices

A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package includes coupling the die to the wire-bond pad. A computing system includes the wire-bonding substrate.

Bond finger on via substrate, process of making same, package made thereby, and method of assembling same

A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routing pattern of collector voltage signals.

Power distribution within a folded flex package method and apparatus

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Phoenix, AZ, United States of America

Ronald L Spreitzer