Smith International, Inc.

Schlumberger Technology Corporation

Ronald K Eyre

Madapusi K Keshavan

J Daniel Belnap

Anthony Griffo

Stewart N Middlemiss

Nathan R Anderson

David Truax

Michael Allen Siracki

Peter Thomas Cariveau

Chris Edward Cawthorne

Thomas W Oldham

Per Ivar Nese

Scott M Packer

Gary Ray Portwood

Yi Fang

Loel Gene Corbett

Ronald B Crockett

Russell J Steel

Yahua Bao

Feng Yu

Ghanshyam Rai

Nephi M Mourik

John Daniel Belnap

Lynn L Belnap

Cheng Peng

Monte E Russell

Christopher A Tucker

Christopher H Weis

David Iverson

Youhe Zhang

Yuelin Shen

Yuri Y Burhan

Zhou Yong

Georgiy Voronin

Xiaoge Gan

Jibin Shi

Venkatesh Karuppiah

Haibo Zhang

Anjie Dong

John L Williams

Yabei Gu

Daniel J Belnap

Per I Nese

Suprant J Huang

Fulong Wang

Richard L Dixon

Ghanshyan Rai

Douglas Marsh

Aaron Madsen

Terry Lee Woodruff

A cutting element may include a substrate having a non-planar upper surface with a peripheral edge, and an ultrahard layer. The upper surface may include at least one depression formed at least proximate the peripheral edge; and a compressive stress hoop extending around the upper surface adjacent the peripheral edge, extending into the at least one depression, and configured to reduce tensile stress in the ultrahard layer. The ultrahard layer may be on the substrate and may have a non-planar top surface and an interface formed between the ultrahard layer and the substrate.

Non planar cutting element with non planar interface design and tools incorporating such elements

A cutting element may include a body, a concave cutting face formed at a first end of the body, the cutting face including one or more cutting ridges adjacent a cutting tip that are raised above the concavity of the cutting face and having a length that is at least about 10% of a diameter of the cutting face. An edge is formed around a perimeter of the cutting face, and the edge has an edge angle defined between a tangent of the cutting face and a cylindrical side surface of the body, the edge angle being acute at the cutting tip and varying around the perimeter of the cutting face.

Polycrystalline diamond cutting element having improved cutting efficiency

A cutting element includes a substrate and an ultrahard layer on an upper surface of the substrate, a top surface of the ultrahard layer having a ridge extending along a major dimension of the top surface from an edge of the top surface, where the ridge has a peak with at least two different roof radii of curvature, and at least two sidewalls sloping in opposite directions from the peak of the ridge at a roof angle, where a first roof angle of the ridge proximate the edge is smaller than a second roof angle in a central portion of the ridge around a longitudinal axis of the cutting element.

Ridge shaped element

A method for sintering includes loading a tool material into a resistance heating element within a HPHT press and heating the resistance heating element at a first axial portion to a control temperature, where a temperature difference is measured between the control temperature and a second temperature measured at a distal axial portion along the resistance heating element, wherein a difference between the control temperature and the second temperature ranges between about 5 percent to about 11 percent of the control temperature.

Graphite heater with tailored resistance characteristics for HPHT presses and products made therein

A method of forming a polycrystalline diamond cutting element includes assembling a diamond material, a substrate, and a source of catalyst material or infiltrant material distinct from the substrate, the source of catalyst material or infiltrant material being adjacent to the diamond material to form an assembly. The substrate includes an attachment material including a refractory metal. The assembly is subjected to a first high-pressure/high temperature condition to cause the catalyst material or infiltrant material to melt and infiltrate into the diamond material and subjected to a second high-pressure/high temperature condition to cause the attachment material to melt and infiltrate a portion of the infiltrated diamond material to bond the infiltrated diamond material to the substrate.

Polycrystalline diamond sintered/rebonded on carbide substrate containing low tungsten

Thermally stable diamond constructions comprise a diamond body having a plurality of bonded diamond crystals, a plurality of interstitial regions disposed among the crystals, and a substrate attached to the body. The body includes a working surface and a side surface extending away from the working surface to the substrate. The body comprises a first region adjacent the side surface that is substantially free of a catalyst material and that extends a partial depth into the diamond body. The first region can further extend to at least a portion of the working surface and a partial depth therefrom into the diamond body. The diamond body can be formed from natural diamond grains and/or a mixture of natural and synthetic diamond grains. A surface of the diamond body is treated to provide the first region, and before treatment is finished to an approximate final dimension.

Thermally stable diamond polycrystalline diamond constructions

A method for making a polycrystalline diamond construction is disclosed, which includes the steps of treating a polycrystalline diamond body having a plurality of bonded together diamond crystals and a solvent catalyst material to remove the solvent catalyst material therefrom, wherein the solvent catalyst material is disposed within interstitial regions between the bonded together diamond crystals, replacing the removed solvent catalyst material with a replacement material, and treating the body having the replacement material to remove substantially all of the replacement material from a first region of the body extending a depth from a body surface, and allowing the remaining amount of the replacement material to reside in a second region of the body that is remote from the surface.

Polycrystalline diamond constructions having improved thermal stability

A method of forming a cutting element may include subjecting a first press containing at least a diamond powder-containing container and a volume of a high melting temperature non-reactive material to a first high pressure high temperature sintering condition to form a sintered polycrystalline diamond wafer including a diamond matrix of diamond grains bonded together and a plurality of interstitial spaces between the bonded together diamond grains; and subjecting a second press containing the sintered polycrystalline diamond wafer and a substrate to a second high temperature high pressure condition, thereby attaching the wafer to the substrate to form a cutting element having a polycrystalline diamond layer on the substrate.

PCD wafer without substrate for high pressure / high temperature sintering

A cutting element may be formed by placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may have a cutting face area to thickness ratio ranging from 60:16 to 500:5 and at least one dimension greater than 8 mm.

Solid PCD cutter

A system for producing thermally stable cutting elements may include a heat source, a pressure vessel, at least one polycrystalline diamond body attached to a carbide substrate, and a leaching agent is disclosed, wherein the heat source includes a container comprising at least one receiving mechanism and at least one retention mechanism, and wherein the carbide substrate is disposed in the at least one receiving mechanism of the pressure vessel, and wherein the leaching agent is disposed in the pressure vessel, and wherein the leaching agent removes the catalyzing material from the interstitial spaces interposed between the diamond particles of the at least one polycrystalline diamond body, and wherein the at least one retention mechanism of the pressure vessel seals at least a portion of the carbide substrate into the at least one receiving mechanism and prevents the leaching agent from contacting at least a portion of the carbide substrate.

Deep leach pressure vessel for shear cutters

In one aspect, a vacuum-sealed can is used during the bonding process to improve the properties of an infiltrated TSP cutting element. In one embodiment, ultra hard diamond crystals and a catalyst material are sintered to form a polycrystalline diamond material (PCD). This PCD material is leached to remove the catalyst, forming a thermally stable product (TSP). The TSP material and a substrate are placed into an enclosure such as a can assembly, heated, and subjected to a vacuum in order to remove gas, moisture and other residuals that can inhibit infiltration of the infiltrant into the TSP layer. The can assembly is then subjected to high temperature, high pressure bonding to bond the TSP material to the substrate. During bonding, material from the substrate infiltrates the TSP layer.

Method of forming a thermally stable diamond cutting element

An ultra-hard construction is disclosed that is prepared by a method comprising the steps of treating a material microstructure having a polycrystalline matrix first phase material and a second phase material from at least a partial region of the material microstructure, wherein the second phase material is disposed within interstitial regions of the material microstructure, and wherein removal of the second phase material creates a porous material microstructure characterized by a plurality of empty voids and replacing the removed second phase material with a replacement material having a thermal characteristic that more closely matched polycrystalline matrix first phase that the second phase material.

Ultra-hard constructions with enhanced second phase

A cutting element is provided, including a substrate and an ultra-hard material layer formed over the substrate. At one end of the substrate is an interface surface that interfaces with the ultra-hard material layer to bond the layer to the substrate. The interface surface includes a first or outer annular section that extends to the peripheral edge of the substrate, and a second or inner section that is radially inside the first section. The interface surface includes several spaced-apart projections arranged in an annular row. In one aspect, each projection has an upper surface that defines a groove bisecting the projection. In another aspect, the interface surface may include a bridge coupling adjacent projections.

Non-planar interface construction

Thermally stable diamond constructions comprise a diamond body having a plurality of bonded diamond crystals and a plurality of interstitial regions disposed among the crystals. A metallic substrate is attached to the diamond body. A working surface is positioned along an outside portion of the diamond body, and the diamond body comprises a first region that is substantially free of a catalyst material, and a second region that includes the catalyst material. The diamond body first region extends from the working surface to depth of at least about 0.02 mm to a depth of less than about 0.09 mm. The diamond body includes diamond crystals having an average diamond grain size of greater than about 0.02 mm, and comprises at least 85 percent by volume diamond based on the total volume of the diamond body.

Growing community of inventors

Orem, UT, United States of America

Ronald K Eyre