Lsi Corporation

Agere Systems Inc.

Avago Technologies General IP (singapore) Pte. Ltd.

Ronald James Weachock

John William Osenbach

Frank Alexander Baiocchi

John Michael DeLucca

Barry J Dutt

Joze E Antol

An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface.

Moisture barrier for a wire bond

It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 &#x3bc;m or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the bonding wire and bonding pad that are not passivated and that promote corrosion. Avoidance of crevice formation through, for example, appropriately choosing the bonding pad and wire configuration substantially avoids such corrosion.

Integrated circuit package including wire bonds

Growing community of inventors

Pottsville, PA, United States of America

Ronald James Weachock