Amkor Technology, Inc.

Other

Tyco Electronics Logistics Ag

Ronald James Schoonejongen

Robert J Hill

Christopher Marc Scanlan

Jeffrey Alan Miks

John Armando Miranda

Frank Joseph Juskey

Michael Paul Gaynor

Douglas Jay Mathews

Anthony LoBianco

Ron Ellenberger

A semiconductor package comprising a substrate which includes a leadframe having a plurality of leads which each define opposed top and bottom surfaces and extends in spaced relation to each other such that gaps are defined therebetween. The substrate further comprises a compound layer which is filled within the gaps defined between the leads. The substrate includes a continuous, generally planar top surface collectively defined by the top surfaces of the leads and compound layer, and a continuous, generally planar bottom surface collectively defined by the bottom surfaces of the leads and compound layer. Attached to the top surface is a semiconductor die which is electrically connected to at least some of the leads.

Pre-molded leadframe

A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.

Multi-chip semiconductor package with integral shield and antenna

A method for overmolding a ceramic substrate for a semiconductor chip or other electrical device, and a resulting package, are disclosed. In one embodiment, plural ceramic substrate panels having a matrix of semiconductor chips thereon are precisely located on and attached to a temporary support member using an alignment tool. The member and the attached ceramic substrate panels are then placed in a mold tool. When the mold tool is closed, it clamps down on the member around the ceramic substrate panel, and not on the ceramic substrate panel itself. A mold compound injected into the mold tool encapsulates the chips and ceramic substrate panels. Subsequently, packages each containing a chip are singulated from the encapsulated ceramic substrate panels.

Method for molding semiconductor package having a ceramic substrate

Apparatus for attaching multiple metal components to integrated circuit modules reduces manufacturing time for module assemblies having metal shields and/or heat sinks that must be applied to multiple modules within a manufacturing assembly. The metal components are manufactured in an array and the array assembly is attached to the integrated circuit substrate. The metal component array is then divided along with the modules after attachment. The modules are sawed apart before or after attachment. A reduction in manufacturing time is achieved through multiple placement of the metal components rather than individual placement.

Method and apparatus for attaching multiple metal components to integrated circuit modules

Growing community of inventors

Chandler, AZ, United States of America

Ronald James Schoonejongen