Reliability Incorporated

Ronald J Darcy

James E Johnson

A system and method for burning-in an integrated circuit comprises a socket capable of receiving and supporting the IC, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. A first thermal interface provides releasable thermal contact between the integrated circuit in the socket and a resiliently mounted heat absorbing member. A second thermal interface is provided between the heat absorbing member and the heat sink.

Burn-in board with adaptable heat sink device

A system and method for burning-in an integrated circuit chip including at least a socket capable of receiving and supporting the chip, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. The heat sink includes a thermal interface in releasable thermal contact with the integrated circuit in the socket. The heat sink removes more heat from the integrated circuit than is generated during the burn-in process and the integrated circuit is maintained within a predetermined desired temperature range by monitoring the temperature of the integrated circuit and supplying make-up heat as needed. Multiple sockets can be grouped together and cooled by a manifolded cooling system, with the temperature of each integrated circuit being individually monitored and controlled.

Growing community of inventors

Houston, TX, United States of America

Ronald J Darcy