Hewlett-Packard Development Company, L.p.

Ronald J Bellomlo

Richard A Schumacher

Rajakrishnan Radjassamy

Brian Matthew Johnson

John A Nerl

Michael C Day

June E Goodwin

Vicki L Smith

One memory module includes a printed circuit board comprising an upper row of memory integrated circuits, a lower row of memory integrated circuits, and a first addressing register and a second addressing register, the first addressing register and a second addressing register each having at least one of address and control input routing primarily provided in a first layer, the first addressing register coupled to the upper row of memory integrated circuits and the second addressing register coupled to the lower row of memory integrated circuits.

Double-high DIMM with dual registers and related methods

Growing community of inventors

Woburn, MA, United States of America

Ronald J Bellomlo