Sun Microsystems, Inc.

Oracle America, Inc.

Oracle International Corporation

Other

Ronald Ho

Robert J Drost

Ashok V Krishnamoorthy

John E Cunningham

Robert David Hopkins

Robert J Proebsting

Arthur R Zingher

Frankie Liu

Ivan E Sutherland

Alex Chow

Xuezhe Zheng

Hiren D Thacker

Robert David Hopkins, Ii

Jon Lexau

Brian Walter O'Krafka

William Stuart Coates

Bruce M Guenin

Ilya A Sharapov

Arlene Proebsting, Legal Representative

Ivan Shubin

David C Douglas

Thomas Germano O'Neill

Michael Oliver McCracken

Dinesh D Patil

Xuehze Zheng

Guoliang Li

David K McElfresh

Elad Alon

Pranay Koka

Jae-sun Seo

Herbert Dewitt Schwetman, Jr

Chih-Kong Ken Yang

Scott M Fairbanks

Craig Stephen Forrest

Kannan Raj

Justin Schauer

Danny Cohen

Philip Amberg

Bernard Tourancheau

Robert J Moffat

Eric Y Chang

Tarik Ono

R David Hopkins

Jonathan K Gainsley

Arlene Proebsting

Brian W O'KRAFKA

In the optical device, a ring-resonator modulator, having an adjustable resonance (center) wavelength, optically couples an optical signal that includes the carrier wavelength from an input optical waveguide to an output optical waveguide. A monitoring mechanism in the optical device, which is optically coupled to the output optical waveguide, monitors a performance metric of an output optical signal from the output waveguide. For example, the monitoring mechanism may monitor: an average optical power associated with the output optical signal, and/or an amplitude of the output optical signal. Moreover, control logic in the optical device adjusts the resonance wavelength based on the monitored performance metric so that the performance metric is optimized.

Wavelength-locking a ring-resonator modulator

Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).

Wavelength-division multiplexing for use in multi-chip systems

The disclosed embodiments provide a system in which a processor chip accesses an off-chip cache via silicon photonic waveguides. The system includes a processor chip and a cache chip that are both coupled to a communications substrate. The cache chip comprises one or more cache banks that receive cache requests from a structure in the processor chip optically via a silicon photonic waveguide. More specifically, the silicon photonic waveguide is comprised of waveguides in the processor chip, the communications substrate, and the cache chip, and forms an optical channel that routes an optical signal directly from the structure to a cache bank in the cache chip via the communications substrate. Transmitting optical signals from the processor chip directly to cache banks on the cache chip facilitates reducing the wire latency of cache accesses and allowing each cache bank on the cache chip to be accessed with uniform latency.

Accessing an off-chip cache via silicon photonic waveguides

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.

Hybrid-integrated photonic chip package with an interposer

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Hybrid integrated photonic chip package

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Hybrid-integrated photonic chip package

A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined.

Determining alignment using a spatially varying charge distribution

A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.

Equalization in proximity communication

An optical device that includes a wavelength-sensitive optical component, which has an associated thermal time constant, is described. Note that an operating wavelength of the wavelength-sensitive optical component is a function of several physical parameters including temperature. Moreover, the optical device includes a heating mechanism that provides heat to the wavelength-sensitive optical component. Furthermore, the optical device includes a driver circuit that provides a pulse-width modulated signal to the heating mechanism. Note that an average pulse-width modulated heat provided by the heating mechanism, and which corresponds to the pulse-width modulated signal, thermally tunes the wavelength-sensitive optical component to a target operating wavelength. Additionally, note that the target operating wavelength corresponds to a target operating temperature of the wavelength-sensitive optical component.

Pulse-width-modulated thermal tuning of optical devices

One embodiment of the present invention provides a method that reduces power consumption by using capacitive coupling to perform a majority detection operation. The method involves driving a plurality of signals onto a plurality of driven wires. The signals are then fed from each driven wire through a corresponding coupling capacitor to a single majority detection wire. In addition, method involves feeding a signal on the majority detection wire and a bias voltage to a differential receiver. The output of the differential receiver switches if the signal on the majority-detection wire switches relative to the bias voltage. The method further involves using the output of the differential receiver to optimize the signals from the plurality of driven wires for transmission across a long signal route. Optimizing the transmission of signals reduces the power consumed by a computer system.

Method for reducing power consumption by using capacitive coupling to perform majority detection

One embodiment of the present invention provides a system that facilitates proximity communication. This system includes a circuit containing a bootstrap transistor and a pass-gate transistor, where the drain of the bootstrap transistor is coupled to the gate of the pass-gate transistor. Note that a first coupling capacitance exists between the source of the pass-gate transistor and the drain of the bootstrap transistor and a second coupling capacitance exists between the drain of the pass-gate transistor and the drain of the bootstrap transistor. During operation, the gate and the source of the bootstrap transistor are coupled to a high voltage, thereby causing an intermediate voltage at the drain of the bootstrap transistor. When the source of the pass-gate transistor transitions to a high voltage, the first coupling capacitance and the second coupling capacitance boost the voltage at the gate of the pass-gate transistor higher than the high voltage, thereby enabling the high voltage at the source of the pass-gate transistor to pass to the drain of the pass-gate transistor.

Circuit that facilitates proximity communication

Some embodiments of the present invention provide techniques and systems for high-bandwidth on-chip communication. During operation, the system receives an input voltage signal which is to be transmitted over a wire in a chip. The system then generates one or more modified voltage signals from the input voltage signal. Next, the system drives each of the voltage signals (i.e., the input voltage signal and the one or more modified voltage signals) through a respective capacitor. The system then combines the output signals from the capacitors to obtain a combined voltage signal. Next, the system transmits the combined voltage signal over the wire. The transmitted signals can then be received by a hysteresis receiver which is coupled to the wire through a coupling capacitor.

High-bandwidth on-chip communication

An optical receiver is described. This optical receiver includes a digital feedback circuit that biases a front-end circuit, which receives an optical signal, so that an analog electrical signal output by the front-end circuit is calibrated relative to a reference voltage corresponding to a decision threshold of a digital slicer in the optical receiver. In particular, during a calibration mode the feedback circuit may determine and store a calibration value that calibrates the analog electrical signal relative to the reference voltage. Then, during a normal operating mode, the feedback circuit may output a current corresponding to the stored calibration value that specifies a bias point of the front-end circuit.

Optical receiver with a calibration mode

Growing community of inventors

Mountain View, CA, United States of America

Ronald Ho