Northrop Grumman Systems Corporation

Westinghouse Electric Corporation

Ronald G Freitag

Eric Jonathan Stewart

Bettina A Nechay

Howell George Henry

Robert Samuel Howell

Justin Andrew Parke

Karen Marie Renaldo

Matthew Russell King

Harlan Carl Cramer

Shalini Gupta

Harvey C Nathanson

Michael W Cresswell

Michael C Driver

Daniel F Yaw

Donald K Alexander

James E Degenford

Marvin Cohn

John W Gipprich

Tapan K Gupta

Cynthia W Berry

Mike L Salib

Daniel C Boire

Joseph A Faulkner

Vincent G Karasack

Benjamin R Myers

Michael J Lee

Brian T McMonagle

Howell G Henry

Gene A Digennaro

Harry V Guy, Iii

David A Blackwell

Mark K Yu

Dave M Krafcsik

Jeffrey A Kruth

Robert B Middleton

John P Vitamvas

Russell R Shaller

Thomas M Walsh

Eric V Miller

Eric D Zirofsky

Kerron R Duncan

A method of forming an integrated circuit can include forming a heterostructure over a substrate structure, wherein the given substrate structure comprises a given semiconductor material. The method can include etching a castellated channel region in an e-mode device area of the heterostructure that defines a plurality of ridge channels interleaved between a plurality of trenches, the ridge channels comprising another semiconductor material. The method can also include forming an isolation region on the heterostructure to electrically isolate the e-mode device area from a d-mode device area of the heterostructure. The method can further include forming a mask with an opening that defines a castellated gate opening overlying the castellated channel region and the mask defines an opening overlaying a single planar gate overlying the d-mode device area of the heterostructure. The method can also include performing a contact fill with conductive material to form a castellated gate contact.

Integrated enhancement mode and depletion mode device structure and method of making the same

A circuit is provided that includes a castellated channel device that comprises a heterostructure overlying a substrate structure, a castellated channel device area formed in the heterostructure that defines a plurality of ridge channels interleaved between a plurality of trenches, and a three-sided castellated conductive gate contact that extends across the castellated channel device area. The three-sided gate contact substantially surrounds each ridge channel around their tops and their sides to overlap a channel interface of heterostructure of each of the plurality of ridge channels. The three-sided castellated conductive gate contact extends along at least a portion of a length of each ridge channel.

A transistor device is provided that comprises a base structure, and a superlattice structure overlying the base structure and comprising a multichannel ridge having sloping sidewalls. The multichannel ridge comprises a plurality of heterostructures that each form a channel of the multichannel ridge, wherein a parameter of at least one of the heterostructures is varied relative to other heterostructures of the plurality of heterostructures. The transistor device further comprises a three-sided gate contact that wraps around and substantially surrounds the top and sides of the multichannel ridge along at least a portion of its depth.

Methods of making multichannel devices with improved performance

A system includes a transmitter to drive a transmission signal via a first and second transmission line. One half of the transmission signal is applied to the first transmission line and the other half of the transmission signal is applied to the second transmission line. An antenna radiates the transmission signal from the transmitter and receives a reception signal. The reception signal is driven in the opposite direction of the transmission signal on the first and second transmission lines. A plurality of differential amplifiers receive the reception signal from different sections of the first and second transmission lines and generate amplified output signals to a receiver output path having a first and second receiver transmission line. The differential amplifiers reject the one half of the transmission signal applied to the first transmission line and the other half of the transmission signal applied to the second transmission line.

Broadband distributed amplifier based active duplexer

A transistor device is provided that includes a base structure and a superlattice structure that overlies the base structure. The superlattice structure comprises a multichannel ridge having sides that extend to the base structure. The multichannel ridge comprises a plurality of heterostructures that each form a channel of the multichannel ridge. A three-sided gate configuration is provided that wraps around and substantially surrounds the top and sides of the multichannel ridge along at least a portion of its depth. The three-sided gate configuration is configured to re-distribute peak electric fields along the three-sided gate configuration to facilitate the increase in breakdown voltage of the transistor device.

Multichannel devices with gate structures to increase breakdown voltage

A dual-channel field effect transistor (FET) device having increased amplifier linearity and a method of manufacturing same are disclosed. In an embodiment, the device includes a channel layer having a top surface and provided within a channel between a source electrode and a drain electrode. A barrier layer is formed on the channel layer in alternating first and second barrier thicknesses along the channel. The first barrier thicknesses form thinner regions and the second barrier thicknesses form thicker regions. A gate electrode is deposited on the barrier layer. The thinner regions have a first pinch-off voltage and the thicker regions have a larger second pinch-off voltage, such that the thinner and thicker regions are configured to turn on at different points on a drain current-gate voltage transfer curve. Transfer curve linearity is increased as a function of the gate voltage.

Dual-channel field effect transistor device having increased amplifier linearity

Multichannel devices with improved performance and methods of making the same

A device is provided that comprises a first pillar disposed in a first region and overlying a base structure, and a second pillar disposed in a second region and overlying the base structure and being spaced apart from the first pillar by a device region. A bridge is disposed in the device region with a first end connected to the first pillar and a second end connected to the second pillar. The bridge includes a top, sides, and a bottom. The bridge is formed from one or more heterostructures with an undercut opening extending from the bottom to an underlying structure. A four-sided conductive contact wraps around and substantially surrounds the bridge around its top, its sides, and its bottom along at least a portion of its length between the first and second end.

All around contact device and method of making the same

Multichannel devices with improved performance

A multi-channel, dual-band, radio frequency (RF) transmit/receive (T/R) module, for an active electronically scanned array, is provided. The module includes a compact, RF manifold connector and at least four T/R channels. Each of the T/R channels includes a notch radiator, a diplexer coupled to the notch radiator, a power amplifier, including at least one dual-band gain stage, coupled to the notch radiator, a low noise amplifier, including at least one lower-band gain stage and at least one upper-band gain stage, coupled to the diplexer, and a T/R cell, including a phase shifter, a signal attenuator and at least one dual-band gain stage, coupled to the power amplifier, the low noise amplifier and the manifold connector.

Dual band quadpack transmit/receive module

The present invention provides a monolithic superheterodyne detector pixel operable to receive a radio frequency (RF) signal at millimeter wavelength and produce a video output signal with many orders of improved sensitivity when compared with the prior art. This sensitivity improvement is achieved by translating the received RF signal to a intermediate frequency (IF) signal before detection of the video signal. At the lower frequency of the IF signal, monolithic amplification circuitry can be fabricated more easily to provide necessary gain than would be achievable if simple amplification of the RF signal were attempted. Detector pixels constructed in accordance with the invention each contain an antenna for receiving the RF signal. Local oscillator (LO) signal circuitry likewise apply an externally generated LO signal to the pixel. The RF signal and LO signal are then applied by interconnecting conductors to appropriate mixer means to produce the IF signal. An IF amplifier next amplifies the IF signal to a level sufficient for detection of the video output signal by a second detector. In presently preferred embodiments, pixel circuitry is fabricated in microstrip format with impedance matching provided between respective monolithic components. The antenna and local oscillator signal circuitry may each comprise slots defined in the metallized ground plane of the detector substrate. Utilization of a subharmonic mixer permits the external LO signal to be a subharmonic of the 'virtual LO' mixed with the received RF signal. The amplifier may comprise a plurality of cascaded field effect transistor (FET) amplifier stages. The second detector, as well as diodes utilized in the mixer, are preferably Schottky barrier diodes.

Millimeter wavelength energy detector pixel having intermediate

In a particular embodiment, the invention is directed to a composite MMIC amplifier comprising a plurality of active devices (e.g., FET, HBT, HEMT) arranged on a semiconductor substrate and having inputs and outputs. A pair of input and output transmission lines are coupled in antiphase arrangement to corresponding inputs and outputs of alternate active devices. Each pair of input transmission lines has branched portions extending from a common polarized input terminal. Each branched portion of like polarity extends to a corresponding alternate input and output of an active device and crosses a branched portion of opposite polarity without interference. Impedance matching means is coupled across antiphase pairs of inputs and outputs of adjacent active devices and forms a virtual ground therebetween thereby simplifying the impedance matching circuit.

Multi push-pull MMIC power amplifier

An improved phased-array active antenna transmit-receive means utilizing a multiplicity of individual transmit-receive cells positioned in an array format upon a common wafer of semiconductor material. Each transmit-receiver cell, comprises a multiplicity of redundant, integrated circuit, electronic devices implanted upon the common semiconductor substrate. The transmit-receive cells utilize novel mitered mechanical switches to permanently interconnect individual electronic devices into either transmit or receive circuits during the fabrication and test of the transmit-receive cells. Radio frequency and direct current input and output vias formed from a novel metal evaporation technique connect the devices upon the surface of the common semiconductor wafer to underlying, insulated direct current distribution circuits and a radio frequency manifold. This array of improved phased-array active antenna transmit-receive means comprised of transmit-receive cells sharing common central processing means, logic control and heat dissipation means results in a significant reduction in the size and weight of the standard phased-array active antenna system. This significant reduction in antenna system size and weight is very important in broad band electronic countermeasure systems or narrow band phased array active antenna radar systems as used in advanced tactical fighters, or space applications.

Mitered mechanical switches

An improved phased-array active antenna transmit-receive means utilizing a multiplicity of individual transmit-receive cells positioned in an array format upon a common wafer of semiconductor material. Each transmit-receive cell, comprises a multiplicity of redundant, integrated circuit, electronic devices implanted upon the common semiconductor substrate. The transmit-receive cells utilize novel mitered mechanical switches to permanently interconnect individual electronic devices into either transmit or receive circuits during the fabrication and test of the transmit-receive cells. Radio frequency and direct current input and output vias formed from a novel metal evaporation technique connect the devices upon the surface of the common semiconductor wafer to underlying, insulated direct current distribution circuits and a radio frequency manifold. This array of improved phased-array active antenna transmit-receive means comprised of transmit-receive cells sharing common central processing means, logic control and heat dissipation means results in a significant reduction in the size and weight of the standard phased-array active antenna system. This significant reduction in antenna system size and weight is very important in broad band electronic countermeasure systems or narrow band phased array active antenna radar systems as used in advanced tactical fighters, or space applications.

Process for producing vias in semiconductor

Growing community of inventors

Catonsville, MD, United States of America

Ronald G Freitag