Impinj, Inc.

Microsoft Technology Licensing, LLC

Microsoft Technology Licnesing, LLC

Ronald E Paulsen

Desney S Tan

Andrew Edward Horch

Shwetak N Patel

Nicolas Villar

Gregory Ray Smith

Daniel Morris

Ronald Lee Koepp

Sidhant Gupta

T Scott Saponas

Gabriel Adam Cohn

Sailaja Malladi

John D Hyde

Yanjun Ma

Jay A Kuhn

Sumit Basu

Jonathan Bernard Lester

David Charles Kale

Larry Morrell

Cameron Bockorick

Scott T Saponas

David C Kale

A wrist-worn device heart-monitoring device is presented. The wrist-worn heart-monitoring device includes a radial tonometer configured to output a pressure signal indicating a pulse pressure wave at a user's wrist, two or more electrodes configured to output an electrical signal indicating a user's heart has been commanded to contract, and a microphone configured to output an audio signal indicating a closing of a user's aortic valve. The wrist-worn heart-monitoring device further includes a pulse transit time monitor configured to calculate a pre-ejection period of the user's heart based on at least the pressure, electrical, and audio signals, and calculate a pulse transit time based on at least the pre-ejection period, the pressure signal, and the electrical signal.

Wrist-worn pulse transit time sensor

A wrist-worn pressure sensing device includes a pressure sensor. The wrist-worn pressure sensing device also includes a first strap that sets the position of the pressure sensor on a wearer's wrist and a second strap that engages with the first strap to adjust the overall length of the strap without moving the set position of the pressure sensor on the wearer's wrist.

Sizable wrist-worn pressure sensing device

Microcircuits may include polysilicon features that are vulnerable to defects due to undesirable phenomena during manufacturing processes such as, inter alia, over-etching. The same phenomena that may cause defects can be exploited to automatically isolate the affected circuit and thus limit the harm caused by defects or incipient defects.

Automatic on-die defect isolation

The present description describes back-end processes, the use of which may help overcome these problems and limitations of the prior art. In one optional embodiment, the back-end process includes depositing a layer over a wafer. The wafer contains a plurality of circuit die for respective RFID tags. The wafer also has exposed metallic regions. The exposed metallic regions include first regions having electrical contacts to the plurality of circuit die and second regions having electrical contacts to the wafer's electrical test sites. The method includes forming exposed first regions and unexposed second regions by etching the layer over the first regions but not over the second regions. The method also includes plating metallic bumps on the exposed first regions.

RFID tag circuit die with shielding layer to control I/O bump flow

Methods are provided, and devices made by such methods. One of the methods includes procuring a semiconductor wafer, processing the wafer to form a plurality of circuits on a top side, forming trenches on the top side between the adjacent circuits, forming a trench passivation layer on side walls of the trenches, forming conductive bumps on the top side of the wafer; and removing material from the bottom side to thin the wafer, and eventually separate the wafer along the trenches into dies, where each die includes only one of the circuits.

Etch before grind for semiconductor die singulation

Growing community of inventors

Woodinville, WA, United States of America

Ronald E Paulsen