International Business Machines Corporation

Globalfoundries Inc.

Ronald Dennis Rose

David J Widiger

Lewis William Dewey, Iii

Steven Joseph Kurtz

David James Hathaway

Susan Elizabeth Cellier

Vladimir P Zolotov

Kerim Kalafala

Hemlata Gupta

Adam P Matheny

Sandy K Kao

Sanjay Upreti

Anthony D Hagin

Gerald F Plumb

Mark Alan Lavin

Gi-Joon Nam

Sourav Saha

Robert J Allen

Sven Peyer

Richard W Taggart

Tak H Ning

Mark Charles Hakey

John Atkinson Fifield

Kenneth Parker Rodbell

Jun Zhou

Kanak Behari Agarwal

John Maxwell Cohn

Sani Richard Nassif

Jason D Hibbeler

Norman Jay Rohrer

James Spiros Nakos

Scott Whitney Gould

Paul Steven Zuchowski

Paul David Kartschoke

Vasant B Rao

Larry Wissel

Ivan L Wemple

Jeffrey Paul Soreff

David Wells Winston

Yiu-Hing Chan

Thomas G Mitchell

Henry H K Tang

Karen Ann Bard

Ali Sadigh

Harold E Reindel

Michael H Sitko

Khalid Rahmat

Chenggang Xu

Anita Natarajan

An effective spacing is calculated for each physical spacing between two or more neighbor nets of a target net. Segment boundaries are determined based on the calculated effective spacing to define segments for the target net and one of the segments is selected. A metal configuration for the selected segment is identified and a table of capacitance per-unit-length is accessed for the identified metal configuration to return an above capacitance value, a below capacitance value, a left-side capacitance value, and a right-side capacitance value for the corresponding segment, the table comprising at least a two-dimensional (2D) table. The capacitance values are scaled based on a corresponding segment length determined from the calculated effective spacing. The selecting, identifying, accessing and scaling operations are repeated for each remaining segment of the target net. Optionally, the above, below, left, and right capacitance values for all segments of the target net are summed.

Capacitance extraction

An integrated circuit includes a target wiring layer, a first adjacent wiring layer above the target wiring layer, and a second adjacent wiring layer below the target wiring layer. Each adjacent wiring layer including crossing wires orthogonal to the target wiring layer. Modify a putative design of the integrated circuit by selecting a target wire; identifying lateral neighbors of the target wire; defining regions of the target wire where the lateral neighbors are homogeneous in cross-section; for each region of the target wire, calculating a wire pattern for the crossing wires; identifying segments within above and below portions of the wire pattern; for each above and below segment pair, obtaining a per-unit-length capacitance from a reduced pattern database; extracting a total parasitic capacitance from the per-unit-length pattern capacitances; and in response to an assessment of the impact of the total parasitic capacitance on circuit performance, producing a modified design.

Extracting parasitic capacitance from circuit designs

A computer-implemented method includes identifying a noise cluster, representing the noise cluster according to a variational model, projecting the variational model onto one or more corners to yield a projected noise cluster, and determining a computed noise for the projected noise cluster. Optionally, the noise cluster includes one or more noise cluster elements, and each of the noise cluster elements are expressed as one or more circuit element terms, according to a canonical form. Optionally, at least one of the corners is a bounding corner. For the bounding corner, the projected noise cluster is generated by maximizing the circuit element terms for those noise cluster elements that tend to increase noise, and by minimizing the circuit element terms for those noise cluster elements that tend to decrease noise, whereby noise is maximized for the canonical form. A corresponding computer program product and computer system are also disclosed.

Analysis of coupled noise for integrated circuit design

The accuracy of electronic design automation is increased by determining whether fill wires in a putative integrated circuit design should be effectively grounded or floating. For each signal wire in the putative design adjacent to the fill wires, a signal sensitivity value, which represents sensitivity of a given one of the plurality of signal wires to noise and timing, is determined. For each one of the fill wires, a fill sensitivity value is determined by: identifying coupling of each one of the fill wires to the adjacent signal wires; and calculating the fill sensitivity value as a combination of the signal sensitivity values of each of the adjacent signal wires for which the coupling has been identified. At least a portion of the fill wires are selectively effectively grounded based on the fill sensitivity value, to obtain a modified design.

Selectively grounding fill wires

A system and method to perform capacitance extraction involves defining a location of signal wires and floating metal of an integrated circuit design. The method includes designating one of the signal wires as a target wire, defining a first area within which first capacitances between the target wire and the floating metal and other signal wires are determined, defining a second area, within which second capacitances between floating metal within the first area and the floating metal and the other signal wires not within the first area are determined, and generating an intermediate capacitive network. The intermediate capacitive network includes the target wire, the floating metal, and the other signal wires within the second area, the first capacitances and the second capacitances. A capacitive network is generated from the intermediate capacitive network. The first capacitances and the second capacitances are used to generate third capacitance values of the capacitive network.

Capacitance extraction for floating metal in integrated circuit

A method for predicting noise propagation in a circuit comprising correlating noise results predicted by a circuit model to a transistor level model with a processor, generating a first best fit data analytics model for identifying the optimal output pin capacitance as a function of circuit conditions and store the first best fit model in a noise rule file in a memory, generating a second best fit data analytics model for predicting noise peak output from the circuit model as a function of the circuit conditions and store the second best fit model in the noise rule file in the memory, and applying the first best fit model and the second best fit model in a noise analysis simulation to identify and simulate an optimal circuit.

Predicting noise propagation in circuits

A system for semiconductor chip fabrication. A host system hosts a capacitance adjust tool for performing calculating a ground capacitance adjust for a wire segment going through routing tiles according to the following operations; providing the routing tiles having a plurality of wires wherein the wire segment being a victim wire and neighboring wires being aggressor wires; computing ground capacitance adjusts for a victim wire averaged across all aggressor slew values and across possible spacing values between the victim wire and the neighboring aggressor wires to take into account a potential coupling effect by the neighboring aggressor wires, to guide placement of the wire segment in the routing tiles to avoid coupling noise; and outputting the placement of the wire segments to a tool for manufacturing the semiconductor chip.

Coupling aware wire capacitance adjust at global routing

A computer implemented method for calculating a ground capacitance adjust for a wire segment going through a given routing tile. The method includes providing the routing tile having a plurality of wires wherein the wire segment being a victim wire and neighboring wires being aggressor wires; computing ground capacitance adjusts for a victim wire averaged across all aggressor slew values and across possible spacing values between the victim wire and the neighboring aggressor wires to take into account a potential coupling effect by the neighboring aggressor wires, assuming a distribution of signal slews of wires belonging to the routing tile and assuming the victim wire's neighbors have signal slews from the distribution of slews for this tile for possible spacing values responsible for the coupling effect, to guide placement of the wire segment in the routing tile to avoid coupling noise.

Disclosed is a method for improving capacitance extraction performance in a circuit, the method including mapping, via a computing resource, a first layout including a plurality of wiring paths, selecting at least one target wire from the plurality of wiring paths, selecting at least one group of wires running orthogonally to the at least one target wire, identifying and selecting within the at least one group at least one set of two or more wires that are combinable for representation as a single merged wire, mapping a second layout, via the computing resource, and representing the at least one set of two or more wires as the single merged wire in said second layout, analyzing parasitic capacitance between the at least one target wire and the at least one group of wires using the second layout, and manufacturing the circuit using information from the analyzing of parasitic capacitance.

Process for improving capacitance extraction performance

Embodiments include methods, processing systems and computer program products for extracting via capacitance. Aspects include placing various shapes of target nets of an IC into a Cshapes collection and a CshapesVia collection, processing the shapes in these collections and placing the processed shapes into a Ctile collection and a CtilesVia collection, and extracting via capacitance of the target nets through each of Cshapes, CshapesVia, Ctiles, and CtilesVia collections. In exemplary embodiments, the processing operation includes: reducing the complexity of the shapes in the shape collections, removing all overhang shapes, and all overlapped shapes from the shape collections, and unioning the shapes in the Cshapes collection and the CshapesVia collection, respectively. Unioning operation includes: unioning shapes from Cshapes collection into a non-overlapping Ctiles collection, unioning shapes from CshapesVia collection into a non-overlapping CtileVia collection, computing the tile intersections of Cshapes collection and CshapesVia collection, and removing intersections from CshapesVia collection.

Methods and computer program products for via capacitance extraction

According to one exemplary embodiment, a method for parallel processing a network of nodes having at least one ordering constraint and at least one conflict constraint is provided. The method may include breaking a plurality of loops caused by the at least one ordering constraint. The method may also include determining a node order based on the at least one ordering constraint. The method may then include determining a conflict order based on the at least one conflict constraint, whereby no new loops are created in the network. The method may further include performing parallel processing of the network of nodes based on the node order and the conflict order.

Efficient parallel processing of a network with conflict constraints between nodes

Growing community of inventors

Essex Junction, VT, United States of America

Ronald Dennis Rose