Texas Instruments Corporation

Ronald A Jascott

Robert G McKenna

Edward Carl Fisher

Homer B Klonis

Richard O Gale

An improved spatial light modulator package comprising a spatial light modulator attached to a central region of a substrate , a sealing ring on said substrate around the central region thereof, a window frame attached to the sealing ring , and a window glued to the window frame . Gluing the window to the window frame avoids distortion of the glass that occurs when the window is heat bonded to the window frame, and avoids having to grind and polish the glass window after it is bonded to the window frame.

Adhesive-sealed window lid for micromechanical devices

A method of passivating a hermetically sealed micromechanical device (14) with a passivant (100). A predetermined quantity of the passivant (100) is placed within the cavity (54) of a lid (42) after the lid and package base (46) have been activated. Thereafter, by heating the package (10) including the passivant, the passivant will sublime within the hermetically sealed package (10) to provide a monolayer of passivant across the active surfaces of the micromechanical die (14). An improved hermetic seal is achieved since the passivant is sublimed after the laser weld process. In addition, the effectiveness of the passivation process is improved since the passivation is performed after the package is sealed, without the risk of any impurities entering into the package to degrade the effectiveness of the passivation.

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Plano, TX, United States of America

Ronald A Jascott