Hewlett-packard Development Company, L.p.

Spectra-physics Gmbh

Hewlett-packard Company

Other

Samsung Electronics Co., Ltd.

Ronald A Hellekson

Alan R Arthur

Barry Craig Snyder

Chien-Hua Chen

Ronnie Yenchik

Samson Berhane

Diane Lai

Hubert Vander Plas

Peter James Fricke

Kenneth E Trueba

Jorge Louis Acosta

Gary J Watts

Chris Aschoff

John S Campbell

Andrew L Van Brocklin

Eric T Martin

James Michael Gardner

Judson Malcolm Leiser

Michael A Pate

James McKinnell

Alfred I-Tsung Pan

Andrew Koll

Jun Gao

Carl E Picciotto

Si-lam Choy

Jeffrey T Hendricks

Neal W Meyer

Marshall Field

John Liebeskind

John M Altendorf

Peter Guy Howard

David M Craig

William R Boucher

Donald S Peterson

Joshua W Smith

Randall J Lonsdale

Diane W Lai

Barry C Snyder

Hubert A Vander Plas

A fluid ejection device may include a laminate fluid manifold comprising plates extending in a plane and stacked in a laminate plate stack. The stack may include a first fluid passage extending parallel to and between plates of the laminate plate stack and a second fluid passage extending parallel to and between plates of the laminate plate stack. The first fluid passage and the second fluid passage overlap when viewed from a direction perpendicular to the plane.

Laminate manifolds for mesoscale fluidic systems

A fluid ejection device may include a laminate fluid manifold including plates in a laminate plate stack. The stack may include a fluid passage extending to an edge of the laminate plate stack. A die maybe secured across the edge of the laminate plate stack, wherein the die includes opening to receive fluid transmitted through the fluid passage.

A print head die includes rows of nozzles. In one implementation, an electrical interconnect is electrically connected to the print head die along a major dimension of the die. In another implementation, a cross connect electrically connects a first column of a of nozzles to print a first color to a second column to print a second color. The cross connect connects the first and second columns between first and second ends of the first and second columns.

Print head die

A method and apparatus test a printed circuit assembly and a print head array with a low-power application to a printed circuit assembly having a power storage component disconnected from a power rail of the printed circuit assembly and test the printed circuit assembly and the print head array with a high-power application to the printed circuit assembly with the printed circuit assembly receiving electrical power from the power storage component.

Print head array testing

Pixel wells and a grid of electrical lines including electrical bridges are formed using an ultraviolet transparent mandrel having a three-dimensional surface and an integrated mask.

Mandrel

A pixel well includes first and second electrodes below a floor.

Pixel well electrodes

An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding the second surface of the substrate and the second surface of the substrate carrier.

Bonded structures formed by plasma enhanced bonding

Various apparatus and methods relating to pixel wells and electrodes that are at least partially concurrently formed are disclosed.

Pixel well electrode

This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.

Bonding an interconnect to a circuit device and related devices

A multi-level mandrel is used to locate an electrode in a pixel well. A display includes an electrode recessed in a floor of a pixel well.

Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

A method of manufacturing a microelectronics device is provided, wherein the microelectronics device is formed on a substrate having a frontside and a backside. The method comprises forming a circuit element on the frontside of the substrate from a plurality of layers deposited on the frontside of the substrate, wherein the plurality of layers includes an intermediate electrical contact layer, and forming an interconnect structure after forming the electrical contact layer. The interconnect structure includes a contact pad formed on the backside of the substrate, and a through-substrate interconnect in electrical communication with the contact pad, wherein the through-substrate interconnect extends from the backside of the substrate to the electrical contact layer.

Method of forming a through-substrate interconnect

A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.

Systems and methods for wafer bonding by localized induction heating

A method comprising adjusting a first relative position between a substrate and a fabrication unit by a first shift value, forming a first pattern relative to a first pattern instance on the substrate subsequent to adjusting the first relative position by the first shift value, and calculating a second shift value using a first displacement between the first pattern and the first pattern instance and a second displacement between a second relative position of the first pattern instance with respect to a second pattern instance is provided.

System and method for calculating a shift value between pattern instances

An optical disc of one embodiment of the invention is disclosed that includes a first surface, a second surface, an optically writable label area, and an optically writable data area. The first and the second surfaces are oppositely situated to one another. The label area is on one of the first and the second surfaces. The data area is on one of the first and the second surfaces. The mechanism aids proper focusing of an optical beam of an optical disc device on the optically writable label area and on the optically writable data area.

Mechanism to aid optical beam focusing on optical disc

Growing community of inventors

Eugene, OR, United States of America

Ronald A Hellekson