Read Rite Corporation

Western Digital (fremont), Inc.

Other

Nanosys, Inc.

Ronald A Barr

Kenneth E Knapp

James Spallas

Benjamin P Law

Ming Zhao

Kyusik Sin

Yingjian Chen

Liubo Hong

Matthew R Gibbons

Lien-Chang Wang

Robert Earl Rottmayer

Zhupei Shi

Mark David Thomas

Billy W Crue, Jr

Dashun Steve Zhou

Bill Crue

Robert S Dubrow

Jason T Hartlove

Jian-Gang Zhu

Chih-Huang Lai

Zi-Wen Dong

Bill W Crue, Jr

Myron R Cagan

Hau-Ching Tong

Russel Stearns

Alguo Feng

Jeffrey P Hagen

The present invention relates to methods of generating liquidphobic surfaces, and surfaces prepared by these methods. The methods include generating sub-micron-structured surfaces and coating these surfaces with a liquidphobic coating, such as a hydrophobic coating.

Methods of generating liquidphobic surfaces

An apparatus comprising an engine, a drive shaft, a first electric motor, and a fly wheel assembly. The engine may be positioned in a vehicle. The drive shaft may be configured to rotate an axle. The first electric motor may be configured to rotated the drive shaft. The fly wheel assembly may be coupled to the engine and may be configured to drive the first electric motor based on data stored within the fly wheel assembly.

Propulsion system

Methods are provided for forming current perpendicular to the plane thin film read heads. In one embodiment, the method comprises the steps of forming a lower sensor lead, forming a lower sensor lead cladding of a low sputter yield material on the lower sensor lead, forming a sensor element on the lower sensor lead cladding, and forming an upper sensor lead coupled to the sensor element. The low sputter yield material helps to reduce redeposition of the lower sensor lead material onto side walls of the sensor element as the sensor element is being formed.

Methods for fabricating redeposition free thin film CPP read sensors

A trailing pole-tip for an electromagnetic transducer is formed as a layer oriented substantially perpendicular to other layers of the transducer, allowing the pole-tip to be made much thinner than conventional pole-tips. The novel pole-tip is formed on an edge or sidewall of a base layer instead of being formed on top of an existing layer. Potential errors in pole-tip thickness are much less than standard error tolerances for conventional pole-tip thickness. Having a greatly reduced pole-tip width significantly reduces the track width so that many more tracks can fit on a media surface, providing a large increase in areal density.

Submicron track-width pole-tips for electromagnetic transducers

A computer disk drive () having a write head () which includes a coil (), a photoresist insulation layer () formed on the coil (), and an insulation shell layer () which is formed on the photoresist insulation layer (). In the first preferred embodiment (), the top pole () of the write head () is formed on the insulation shell layer (). In the second preferred embodiment (), the disk drive write gap () is formed on the insulation shell layer () and the top pole () of the write head () is formed on the write gap (). The insulation shell layers () in both embodiments are preferably made of dielectric materials (). Methods of fabrication for these embodiments are also disclosed.

Insulation layer structure for inductive write heads and method of fabrication

The present invention provides an improved thin film write head and method of fabrication capable of providing an ultra-short yoke and/or an ultra-low conductor winding stack. The present invention reduces yoke length and stack height by forming the conductor winding in a trench etched from an insulation layer, preferably formed of an inorganic insulation material. A thin resist mask is used to define the width of the trench while the etch process defines the depth. Preferably, the insulation layer is formed on a different inorganic insulation material to control the etch process, thus, the conductor winding may be formed on the underlying layer. The conductor winding preferably is formed by depositing conductor material so that it fills the trench and then planarizing, such as by chemical mechanical polish, to remove conductor material deposited outside the trench. An organic insulation layer, such as cured photoresist, may be deposited on the planarized surface of the conductor winding to insulate it from an overlying yoke. This overlying organic insulation layer may also define the apex angle of the head. The present invention may have multiple layers of conductor winding. The subsequent layers of conductor may be formed similar to the first layer, or may be formed with conventional photoresist processes and structures. The present invention may utilize any known pole structure or material.

Ultra-short yoke and ultra-low stack height writer and method of fabrication

The present invention provides an improved current perpendicular to the plane thin film read head device and method of fabrication. With the present invention, the lower lead is formed to inhibit accumulation of redeposited lead material on CPP sensor element side walls during CPP sensor formation. In the preferred embodiment, the upper portion of the lower lead, which normally is etched during sensor element formation, is formed of a low sputter yield material to reduce redeposition flux to the sensor side walls. It is also preferred to form the upper portion of a material that also has a low value for the ratio of its sputter yield at the lead milling angle-to-its sputter yield at the side wall milling angle to inhibit redeposition accumulation on the side wall. It is preferred to clad conventional lead material with a low sputter yield ratio, low resistivity material, to inhibit side wall redeposition accumulation while also providing a low resistance lower lead. The underlying lead material may be formed of conventional low resistance lead materials with a cladding of a refractory metal, such as tantalum, titanium, tungsten, molybdenum, zirconium, vanadium, niobium, their alloys, or the like. The improved CPP read head of the present invention may be embodied in a data storage and retrieval apparatus.

Structure and method for redeposition free thin film CPP read sensor fabrication

Methods for reducing feature sizes of devices such as electromagnetic sensors are disclosed. A track width of a MR sensor is defined by a mask having an upper layer with a reduced width and a lower layer with a further reduced width. Instead of or in addition to being supported by the lower layer in the area defining the sensor, the upper layer is supported by the lower layer in areas that do not define the sensor width. In some embodiments the upper layer forms a bridge mask, supported at its ends by the lower layer, and the lower layer is completely removed over an area that will become a sensor. Also disclosed is a mask having more than two layers, with a bottom layer completely removed over the sensor area, and a middle layer undercut relative to a top layer.

Magnetoresistive sensors having submicron track widths and method of making

In at least one embodiment, the apparatus of the invention is a read sensor which includes a shield, a sensor element, a read gap positioned between the shield and the sensor element, and an extra gap positioned between the shield and the sensor element and adjacent the read gap. The sensor element is positioned in a sensor layer. With the sensor element and the shield separated by only the relatively thin gap layer, high sensitivity of the sensor element is obtained. Further, by placing the relatively thick extra gap between the shield and the sensor layer and about the sensor element, the potential for shorting is minimized. The shield can be planarized to keep the read gap and the sensor layer at, and about, the sensor element substantially planar. This, in turn, results in improved control of sensor track widths and greatly reduces the potential for pooling of photoresist. In at least one embodiment, the method of the invention is for fabricating a read sensor and includes depositing a read gap onto a planarized shield, depositing an extra gap adjacent an exposed portion of the read gap, and depositing a sensor element onto the exposed portion of the first gap and adjacent to the extra gap.

Data storage and retrieval apparatus with thin film read head having a planar sensor element and an extra gap and method of fabrication thereof

Data storage and retrieval apparatus with thin film read head having inset extra gap insulation layer and method of fabrication

The present invention provides an improved bias magnet-to-magnetoresistive element interface and method of fabrication. In a preferred embodiment, the wall/walls of an MR element opposing a bias layer are formed by over etching to provide vertical side walls without taper. In the preferred embodiment, a protective element is formed over the MR element to protect it during etch processes. In some embodiments, a filler layer is deposited prior to bias layer formation. In CIP embodiments, any portion of the filler layer forming on vertical side walls of the MR element is etched to provide an exposed side wall surface for contiguous bias layer formation. In CPP embodiments, the filler layer forms on a vertical back wall and electrically insulates the MR element from the bias layer. In CIP and CPP embodiments, tapered portions of the bias material, which form overhanging the MR element, are removed by directional etching to improve the direction and stability of the induced longitudinal field within the MR element. In some CIP embodiments, tapered overhang removal allows for formation of improved lead structures, which may be deposited on the MR element closer to the side walls, and which are not pinched off by the overhang of an underlying bias layer, thus improving current density profile and definition of the actual effective track width of the device.

Thin film read head structure with improved bias magnet-to-magnetoresistive element interface and method of fabrication

Embodiments in accordance with the thin film write head of the present invention have a lower pole structure, an upper pole structure, and a multilayer write gap extending from an air bearing surface between the upper and lower pole structures. In preferred embodiments, the write gap comprises at least two of: (a) a first layer covering a lower pole tip portion of the lower pole structure, (b) a second layer covering turns of a semiconductor winding, or (c) a third layer covering a winding insulation stack. In more preferred embodiments, the write gap is formed of the first, the second, and the third write gap layers. An advantage of a write head with a multilayer write gap is that it allows better control of write gap thickness. As such, loss of write gap thickness can be compensated for by deposition of the second write gap layers, or by deposition of the third write gap layer. Some embodiments have one or more additional advantages in providing increased corrosion prevention, improving the integrity of conductor insulation, and/or improving the top pole magnetic material characteristics.

Thin film writer with multiplayer write gap

A magnetoresistive device includes a metal layer, formed over a substrate, in which a groove is formed. A magnetoresistive element is formed in the groove, forming two magnetoresistive element portions that are separated by a conductive element. A sense current applied to the metal layer flows through the two magnetoresistive element portions with a predominant current-perpendicular-to-plane component. The method includes techniques that are less complex and less expensive than submicron photolithography to form the above described magnetoresistive device with submicron geometries.

CPP magnetoresistive device and method for making same

A thin film read/write head with a high performance inductive write section that demonstrates good physical pole tip geometry control and is simple and economical to process. The head delineates an air bearing surface, and includes a pedestal formed on a read section. The pedestal includes a back edge that defines a zero throat level which lies in a plane substantially parallel to the air bearing surface. A pole layer is formed over, and separated from the pedestal to define a write gap therebetween. The pole layer includes an angled edge so that a top yoke can be stitched therealong to the pole layer.

Growing community of inventors

Mountain View, CA, United States of America

Ronald A Barr