Siemens Aktiengesellschaft

Roman Kögler

Thomas Schwinn

Lutz Namyslo

Jens Schmenger

Bernd Roppelt

A heat sink assembly for semiconductor components includes a first and second heat sinks, each having a component and cooling fin side, which is provided with cooling fins arranged one behind another such that a cooling medium initially flows in a flow direction through cooling channels formed by the cooling fins of the first heat sink and subsequently flows through cooling channels formed by the cooling fins of the second heat sink, wherein a first inlet cross-section which, on an inlet side of the first heat sink, composed of individual cross-sections of the associated cooling channels of the first heat sink, is reduced via a partition partially covering the cooling channels on the inlet side of the first heat sink, and a second inlet cross-section which, on an inlet side of the second heat sink, is composed of individual cross-sections of the associated cooling channels of the second heat sink.

Heat sink assembly and power converter assembly

A power module includes a heat sink, a power unit formed at least partially inside the heat sink and/or on the heat sink and comprising a semiconductor element and a substrate, and a device designed to enclose the power unit and to center a control unit with respect to the power unit. The device includes a frame designed to surround the substrate at least partially, a first projecting section designed to engage in a recess or an opening of the heat sink, and a second projecting section designed to engage in a recess or an opening or a notch of the control unit and to have an outline which when viewed in cross-section is at least essentially star-shaped with at least a first leg, a second leg and a third leg.

Growing community of inventors

Nuremberg, Germany

Roman Kögler