Siemens Aktiengesellschaft

Roman Beyer

Ralph Reiche

Ulrich Bast

Uwe Dunkel

Methods for examining through holes of a component according to prior art generally use hot gases for the thermographic detection of blockages. The inventive method for examining the structure of through holes of a component considerably simplifies said techniques, using a medium which has at least one absorption edge in the region of the wavelength of the camera and thus appears opaque in the camera image.

Method for examining the structure of through-holes of a component

A method and device for layer thickness determination allows for the layer thickness to be determined in situ during the coating process. This is achieved using a sensor which has an electrical property which, as a result of the coating process, changes in a manner which is representative of the layer thickness which has been reached. As such, this property can be measured.

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Berlin, Germany

Roman Beyer