Stmicroelectronics S.a.

Stmicroelectronics (crolles 2) Sas

Romain Pilard

Frederic Gianesello

Cedric Durand

Frédéric Gianesello

Daniel Gloria

Cédric Durand

Andreia Cathelin

Mathieu Egot

Florence Sonnerat

A transformer of the balanced-unbalanced type includes a primary inductive circuit and a secondary inductive circuit housed inside an additional inductive winding connected in parallel to the terminals of the secondary circuit and inductively coupled with the primary circuit and the secondary circuit.

Transformer of the balanced-unbalanced type

An antenna circuit includes a first antenna tuned to a first fundamental frequency and a second antenna tuned to a second fundamental frequency different from the first fundamental frequency. A first filter has a first terminal connected to the first antenna and attenuates the frequency components outside of a band defined by the first fundamental frequency or its harmonics. A second filter has a first terminal coupled to the second antenna and attenuates the frequency components outside of a band defined by the second fundamental frequency or its harmonics. A passive recombination element couples the second terminals of the two filters to a common terminal.

Antenna circuit using multiple independent antennas simultaneously through a single feed

Transmission/reception device for signals having a wavelength of the microwaves, millimeter or terahertz type, comprising an antenna array. The antenna array comprises a first group of first omni-directional antennas and a second group of second directional antennas disposed around the first group of antennas.

Antenna array for transmission/reception device for signals with a wavelength of the microwave, millimeter or terahertz type

A semiconductor device includes a substrate. On at least one face of that substrate, integrated circuits are formed. At least one electromagnetic waveguide is also included, that waveguide including two metal plates that are placed on either side of at least one part of the thickness of the substrate and are located facing each other. Two longitudinal walls are placed facing each other and are formed by metal vias made in holes passing through the substrate in its thickness direction. The metal vias electrically connect the two metal plates.

Growing community of inventors

Goncelin, France

Romain Pilard