Mellanox Technologies, Ltd.

Rom Becker

Ayal Shabtay

Bar Noyman

Jamal Mousa

Igor Loiferman

Alon Rokach

Kfir Katz

Beeri Halachmi

Oren Weltsch

Tomer Klein

Shay Zaretsky

Yuval Blayer

Yuval Dagan

A network interface device may include: a frame having: a first frame end, a second frame end, a top frame surface, a bottom frame surface, a first lateral frame surface and a second lateral frame surface, wherein the top frame surface includes a longitudinal frame indent extending along a portion of the top frame surface and between the first lateral frame surface and the second lateral frame surface; and heat dissipating members protruding from the longitudinal frame indent of the top frame surface.

Network interface device having heat dissipating members

A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

Device with integrated liquid cooling system

A device may include a printed circuit board (PCB), a plurality of surface-mount devices disposed on the PCB, wherein a thermal mass of each of the surface-mount devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value, and a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value of the surface-mount devices.

Electronic assembly and method for thermal balancing of surfacemount devices

Growing community of inventors

Ramat Yishai, Israel

Rom Becker