Growing community of inventors

Schopfheim, Germany

Rolf Schwald

Average Co-Inventor Count = 2.80

ph-index = 5

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 101

Rolf SchwaldSergej Lopatin (2 patents)Rolf SchwaldManfred Eckert (2 patents)Rolf SchwaldAlexander Hardell (2 patents)Rolf SchwaldKlaus Feisst (1 patent)Rolf SchwaldPeter Klofer (1 patent)Rolf SchwaldWinfried Maier (1 patent)Rolf SchwaldRoland Muller (1 patent)Rolf SchwaldManuel Sautermeister (8 patents)Rolf SchwaldKlaus Pankratz (1 patent)Rolf SchwaldEdwin Steinebrunner (1 patent)Rolf SchwaldRonny Hoffmann (0 patent)Rolf SchwaldAndreas Kaiser (0 patent)Rolf SchwaldRolf Schwald (7 patents)Sergej LopatinSergej Lopatin (60 patents)Manfred EckertManfred Eckert (10 patents)Alexander HardellAlexander Hardell (8 patents)Klaus FeisstKlaus Feisst (12 patents)Peter KloferPeter Klofer (11 patents)Winfried MaierWinfried Maier (10 patents)Roland MullerRoland Muller (9 patents)Manuel SautermeisterManuel Sautermeister (8 patents)Klaus PankratzKlaus Pankratz (6 patents)Edwin SteinebrunnerEdwin Steinebrunner (5 patents)Ronny HoffmannRonny Hoffmann (0 patent)Andreas KaiserAndreas Kaiser (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Endress+hauser Gmbh+co. (4 from 117 patents)

2. Other (1 from 832,843 patents)

3. Endress+hauserse+co. Kg (1 from 280 patents)

4. Endress U. Hauser Gmbh U. Co. (1 from 70 patents)


7 patents:

1. 12298168 - Fill level measurement device

2. 6800241 - Process for producing dielectric component

3. 6417748 - Filling level measuring device operating with microwaves, having an insert composed of a dielectric, and process for producing the dielectric

4. 5866815 - Fill-level indicator

5. 5778726 - Device for monitoring a predetermined level of a liquid in a container

6. 5737963 - Ultrasonic transducer

7. 5363341 - Level measuring device which can be assembled from components

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as of
12/26/2025
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