Robert Boschgmbh

Rolf Scheben

Burkhard Kuhlmann

Christoph Schelling

Thorsten Balslink

Benjamin Schmidt

Daniel Christoph Meisel

Robert Maul

Mirko Hattass

Ricardo Ehrenpfordt

Torsten Ohms

Benedikt Stein

Michael Stumber

Rudy Eid

Fabian Purkl

Johannes Classen

Reinhard Neul

Thomas Buck

Friedjof Heuck

Odd-Axel Pruetz

Matthias Kuehnel

Nils Felix Kuhlmann

Christian Hoeppner

Cristian Nagel

Wolfram Geiger

Ralf Ameling

Steffen Markisch

Jochen Reinmuth

Lars Tebje

Jochen Zoellin

Heiko Stahl

Arnim Hoechst

Bernhard Gehl

Amin Jemili

Denis Gugel

Robert Sattler

Theresa Lutz

Benny Pekka Herzogenrath

Jan Waldmann

Mirko Hofmann

Dusan Radovic

Mike Daley

Steffen Becker

Hartmut Ruf

Alexander Tsapkolenko

A sensor system. The sensor system includes a rotation rate sensor and a control unit, the rotation rate sensor including a seismic mass and being configured to drive a movement of the seismic mass with the aid of a driving force, the control unit being configured to detect a free fall of the sensor system and to deactivate the driving force in the event of a detection of the free fall. A method for securing a sensor system, in a detection step a free fall of the sensor system being detected by the control unit, and in a securing step the driving force being deactivated by the control unit, is also described.

Sensor system and method for securing a sensor system

A micromechanical component for a rotation rate sensor. The micromechanical component includes two rotor masses, mirror symmetrical with respect to a first plane of symmetry aligned perpendicularly to a substrate surface and passing through the center of the two rotor masses, which may be set in rotational vibrating motion about rotational axes aligned perpendicularly to the substrate surface, and four seismic masses, mirror symmetrical with respect to the first plane of symmetry, deflectable in parallel to the first plane of symmetry using the two rotor masses set in their respective rotational vibrating motion. The first rotor mass and a first pair of the four seismic masses connected thereto are mirror symmetrical to the second rotor mass and to a second pair of the four seismic masses connected thereto with respect to a second plane of symmetry aligned perpendicularly to the substrate surface and to the first plane of symmetry.

Micromechanical component for a rotation rate sensor and corresponding manufacturing method

A method for temperature compensation of a MEMS sensor. The method includes: in a balancing step, a temperature gradient is produced by a thermal element and a first and a second temperature are determined at a first and a second temperature measurement point, wherein a deflection of a movable structure produced by the temperature gradient is measured and a compensation value is ascertained dependent on the first and second temperature and the deflection; in a measurement step, a physical stimulus is measured by way of a deflection of the movable structure and a third and fourth temperature is determined at the first and second temperature measurement points; in a compensation step, a measured value of the physical stimulus is ascertained dependent on the measured deflection, the third and fourth temperature and the compensation value. A method is also provided including: a regulation step, and a measurement step.

Method for temperature compensation of a microelectromechanical sensor, and microelectromechanical sensor

A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

Micromechanical structure and micromechanical sensor

A micromechanical component for a yaw rate sensor. The component includes a substrate having a substrate surface, a first rotor mass developed in one piece, which is able to be set into a first torsional vibration about a first axis of rotation aligned perpendicular to the substrate surface, and at least one first component of the micromechanical component. The first rotor mass is connected to the at least one first component via at least one first spring element. The at least one first spring element extends through a lateral concavity on the first rotor mass in each case and is connected to a recessed edge region of the first rotor mass. A yaw rate sensor and a production method for a micromechanical component for a yaw rate sensor, are also described.

Micromechanical component for a yaw rate sensor and corresponding production method

A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.

Micromechanical device including a stop spring structure

A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.

Micromechanical sensor

A microelectromechanical component including, vertically at a distance from one another, a substrate device, a first, a second, and a third functional layer, a vertical stop being formed between the second and third functional layer, the vertical stop having a stop area on a surface of the second functional layer facing the third functional layer, wherein the second functional layer is connected to the first functional layer in a connecting area allocated to the stop area.

Microelectromechanical component

A micromechanical rate-of-rotation sensor includes a first Coriolis element. The micromechanical rate-of-rotation sensor further includes a first drive beam arranged along the first Coriolis element. The first drive beam is coupled via a first spring to the first Coriolis element. The micromechanical rate-of-rotation sensor further includes a first drive electrode carrier extending from the first drive beam in a direction opposite to the first Coriolis element. The first drive electrode carrier is configured to carry a multiplicity of first drive electrodes extending parallel to the first drive beam.

Micromechanical yaw rate sensor and method for operating same

A micromechanical yaw rate sensor includes a substrate and a rotationally oscillating mass having a rotationally oscillating mass bearing. The rotationally oscillating mass bearing includes a rocker bar, a rocker spring rod which resiliently connects the rocker bar to the substrate, and two support spring rods which resiliently connect, on opposite sides of the rocker spring rod, the rocker bar to the rotationally oscillating mass.

Micromechanical yaw rate sensor and method for the production thereof

A sensor drive includes at least one first seismic mass and an operating apparatus. The operating apparatus is configured to put the first seismic mass into oscillatory motion such that (i) a projection of the oscillatory motion of the first seismic mass onto a first spatial direction is a first harmonic oscillation of the first seismic mass at a first frequency, and (ii) a projection of the oscillatory motion of the first seismic mass onto a second spatial direction oriented at an angle to the first spatial direction is a second harmonic oscillation of the first seismic mass at a second frequency not equal to the first frequency. A method includes operating such a sensor device having at least one seismic mass.

Sensor device and method for operating a sensor device having at least one seismic mass

Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.

MEMS component including a diaphragm element which is attached via a spring structure to the component layer structure

A concept is provided which permits the implementation of MEMS microphone elements having a very good SNR, high microphone sensitivity and a large frequency bandwidth. The microphone structure of the MEMS element is implemented in a layer structure and includes at least one sound pressure-sensitive diaphragm (), an acoustically permeable counter element () and a capacitor system for detecting the diaphragm deflections, the diaphragm () and the counter element () being situated on top of each other and a distance apart from one another in the layer structure and each bring equipped with at least one electrode of the capacitor system. According to the invention, the layer structure of the diaphragm () includes at least one thin closed layer () and at least one thick structured layer (), a grid structure () covering the entire diaphragm area being provided in the thick layer (), which determines the stiffness of the diaphragm ().

MEMS microphone element

A rotation rate sensor for detecting a rotational movement of the rotation rate sensor about a rotational axis extending within a drive plane of the rotation rate sensor include: a first rotational element, a second rotational element and a drive structure moveable in parallel to the drive plane, the first rotational element being drivable about a first center of rotation to achieve a first rotational vibration in parallel to the drive plane, the second rotational element being drivable about a second center of rotation to achieve a second rotational vibration in parallel to the drive plane, the drive structure being (i) coupled to the first and second rotational elements, and (ii) configured to generate a drive mode in phase opposition of the first and second rotational vibrations.

Rotation rate sensor and a method for operating a rotation rate sensor

For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

MEMS component including a sound-pressure-sensitive diaphragm element and piezosensitive signal detection

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Reutlingen, Germany

Rolf Scheben