Intel Corporation

Rolf Laido

Thomas A Boyd

Ralph V Miele

Eric W Buddrius

Mustafa H Haswarey

Andrew Larson

Shelby A Ferguson

Daniel Neumann

Divya Swamy Bandaru

Duck Young Kong

Russell S Aoki

Gregory A Peek

Yoshifumi Nishi

Gregorio R Murtagian

Kimi Morooka Jensen

Bijoyraj Sahu

Steven A Klein

Anthony P Valpiani

Craig J Jahne

Eric Dwight McAfee

Kevin Ceurter

Feroz Mohammad

Dan H Gerbus

Kerry A Stevens

Evan A Chenelly

Stephen J Allen

Ming-Chen Chang

Jorge Contreras Perez

Shaun Gerrit Immeker

Rachel Taylor

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

Socket load regulation utilizing CPU carriers with shim components

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions

A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

Method and apparatus for detaching a microprocessor from a heat sink

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

Particular embodiments described herein provide for an electronic device, that includes a first housing and a wireless charging stand. The first housing can include a display. The wireless charging stand can include a power receiving unit and is configured to wireless charge the electronic device and support the first housing at different viewing angles of the display.

Wireless charging stand

Growing community of inventors

Sherwood, OR, United States of America

Rolf Laido